EP4CE40F23C9LN

The EP4CE40F23C9LN is a Cyclone® IV E family Field Programmable Gate Array (FPGA) IC from Intel, providing a medium-density programmable logic fabric in a compact 484-ball BGA package. It combines a significant logic capacity with embedded RAM and a broad I/O count to address a range of board-level digital functions.

With 39,600 logic elements, approximately 1.16 Mbits of on-chip RAM and 328 I/Os in a 484-FBGA (23×23) surface-mount package, this device is aimed at designs that require substantial programmable logic, embedded memory, and flexible interfacing within a commercial operating range.

Key Features

• Logic Capacity — 39,600 logic elements for implementing user-defined digital functions and glue logic.
• Embedded Memory — Approximately 1.16 Mbits of on-chip RAM to support buffering, lookup tables and state storage.
• I/O Resources — 328 general-purpose I/Os to connect with peripherals, buses and board-level interfaces.
• Power Supply — Core voltage supply range of 0.97 V to 1.03 V, suitable for the Cyclone IV E core requirements.
• Package & Mounting — 484-ball FBGA (23×23) in a surface-mount package for dense board integration.
• Operating Grade & Temperature — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance — RoHS compliant, meeting common environmental design requirements.
• Documentation — Supported by Cyclone IV device documentation and device handbook resources for design and system integration guidance.

Typical Applications

• Custom Digital Logic — Implement user-defined logic functions, finite-state machines and glue logic leveraging 39,600 logic elements.
• Embedded Memory–Centric Designs — Use approximately 1.16 Mbits of on-chip RAM for buffering, FIFOs or state storage within digital systems.
• Board-Level Interface and I/O Expansion — 328 I/Os provide broad connectivity for parallel interfaces, bus bridging and I/O-intensive subsystems.
• Prototype and Product Development — Commercial-grade device and comprehensive Cyclone IV documentation support lab evaluation and product development across 0 °C to 85 °C environments.

Unique Advantages

• High Logic Density: 39,600 logic elements enable complex logic implementations without external ASIC development.
• Integrated On-Chip RAM: Approximately 1.16 Mbits of embedded memory reduces the need for external memory components in many designs.
• Extensive I/O Count: 328 I/Os simplify system integration by providing plentiful interface connections on a single device.
• Compact BGA Packaging: 484-FBGA (23×23) surface-mount package supports high-density board layouts and reliable soldered mounting.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation for general-purpose and development environments.
• RoHS Compliant: Meets environmental compliance requirements for lead-free assembly.

Why Choose EP4CE40F23C9LN?

The EP4CE40F23C9LN positions itself as a solid mid-range Cyclone IV E FPGA that balances logic capacity, embedded memory and I/O density in a compact BGA package. Its specifications make it suitable for designers who need flexible programmable logic, significant on-chip RAM, and a large number of I/Os within a commercial-temperature product or development setting.

Backed by Cyclone IV device documentation and the Intel/Altera product family resources, EP4CE40F23C9LN offers a documented platform for scaling designs and integrating programmable logic into production or prototype boards while maintaining RoHS compliance.

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