EP4CE40F23I8LN

The EP4CE40F23I8LN is an Intel Cyclone IV E field-programmable gate array (FPGA) offered in a 484-ball BGA package. It provides a mid-range integration point with 39,600 logic elements, approximately 1.16 Mbits of on-chip RAM, and 328 general-purpose I/O pins for dense, flexible system designs.

With an industrial temperature grade and a low-voltage core supply, this device targets industrial and embedded applications that require robust operation across extended temperatures, significant on-chip logic and memory resources, and a compact surface-mount package.

Key Features

• Logic Capacity — 39,600 logic elements to implement combinational and sequential logic, custom state machines, and glue logic.
• Embedded Memory — Approximately 1.16 Mbits of on-chip RAM for buffering, FIFOs, and small data stores without external memory.
• I/O Resources — 328 I/O pins to support multiple interfaces, sensor arrays, control busses, and board-level connectivity.
• Power and Core Voltage — Core voltage supply specified from 0.97 V to 1.03 V, enabling predictable power budgeting and supply design.
• Package and Mounting — 484-ball FBGA (23 × 23) surface-mount package (484-BGA) for compact board integration and high pin density.
• Temperature Range — Industrial operating temperature range from −40 °C to 100 °C for reliable operation in demanding environments.
• Regulatory Compliance — RoHS compliant to meet common environmental requirements for electronic assemblies.

Typical Applications

• Industrial Control and Automation — Implement motor control logic, I/O aggregation, and real-time control functions using the device’s logic and I/O density within industrial temperature ranges.
• Embedded Systems and Prototyping — Use on-chip memory and ample logic elements for custom peripheral interfaces, data handling, and prototype SoC integration.
• Communications and Networking — Aggregate multiple parallel interfaces and implement protocol glue logic leveraging the high I/O count and on-chip RAM for buffering.
• Instrumentation and Test Equipment — Build flexible measurement and signal-processing front ends where reprogrammability and a compact BGA package are advantageous.

Unique Advantages

• Balanced Logic and Memory — 39,600 logic elements combined with approximately 1.16 Mbits of embedded RAM enable both control logic and local data storage without immediate external memory needs.
• High I/O Count — 328 I/Os simplify board-level routing for multi-channel sensor arrays, parallel interfaces, or mixed-signal front ends.
• Industrial-Grade Operation — Rated for −40 °C to 100 °C to support deployments in harsh or temperature-variable environments.
• Compact, High-Density Package — 484-FBGA (23 × 23) offers a small footprint with substantial pin count for space-constrained designs.
• Predictable Power Design — Specified core supply range (0.97–1.03 V) helps simplify power-supply selection and thermal planning.
• RoHS Compliant — Aligns with common environmental and regulatory requirements for electronics manufacturing.

Why Choose EP4CE40F23I8LN?

The EP4CE40F23I8LN positions itself as a practical FPGA choice for engineers needing a combination of mid-range logic capacity, meaningful on-chip RAM, and a high I/O count in a compact surface-mount BGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-life embedded and industrial applications.

Supported by Cyclone IV family documentation, this device fits designs that require reprogrammable logic near controllers and sensors, I/O expansion, or custom interface implementation while maintaining clear power and packaging characteristics for production deployment.

Request a quote or submit an inquiry to receive pricing and availability information for EP4CE40F23I8LN.