EP4CE40F29C7N
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 532 1161216 39600 780-BGA |
|---|---|
| Quantity | 422 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BGA | Number of I/O | 532 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2475 | Number of Logic Elements/Cells | 39600 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1161216 |
Overview of EP4CE40F29C7N – Cyclone IV FPGA, 39,600 Logic Elements, 780-BGA
The EP4CE40F29C7N is a Cyclone® IV field-programmable gate array (FPGA) supplied in a 780-ball FBGA (29×29) package. It provides a mid-range programmable logic resource with 39,600 logic elements, approximately 1.16 Mbits of embedded RAM, and 532 I/O pins for flexible system interfacing.
With a core supply range of 1.15 V to 1.25 V and a commercial operating temperature range of 0 °C to 85 °C, this device targets commercial embedded designs that require reconfigurable logic capacity, on-chip memory, and high I/O density in a compact surface-mount package.
Key Features
- Logic Capacity — 39,600 logic elements to implement mid-range programmable logic, custom datapaths, and glue-logic functions.
- Embedded Memory — Approximately 1.16 Mbits of on-chip RAM for FIFOs, buffering, and local storage to support data-heavy logic functions.
- I/O Density — 532 user I/O pins enabling multiple high-pin-count interfaces and dense external connectivity.
- Power and Supply — Core voltage supply range of 1.15 V to 1.25 V, allowing precise power sequencing and compatibility with systems designed for Cyclone IV core voltages.
- Package and Mounting — 780-ball FBGA (29×29) in a surface-mount package for compact board-level integration.
- Operating Range — Commercial grade operation from 0 °C to 85 °C suitable for a wide range of commercial embedded applications.
- Standards and Documentation — RoHS compliant. Comprehensive device handbook and datasheet sections cover operating conditions, DC characteristics, I/O specifications, power consumption, switching characteristics, and transceiver/core performance.
Typical Applications
- Custom Digital Logic — Implement application‑specific state machines, data processing pipelines, and protocol handlers using the device’s logic and embedded RAM.
- Interface Bridging — Bridge between multiple high‑pin-count interfaces or adapt legacy and modern buses using the 532 I/O pins.
- Control and Monitoring — Use the FPGA’s reconfigurability and on-chip memory for control algorithms, sensor aggregation, and instrumentation tasks in commercial systems.
Unique Advantages
- Balanced Logic and Memory — 39,600 logic elements paired with ~1.16 Mbits of RAM provides the right mix for mid-range designs that need both compute and local storage.
- High I/O Count — 532 I/O pins reduce the need for external multiplexers or expanders, simplifying board routing and lowering BOM complexity.
- Compact Packaging — 780-FBGA (29×29) surface-mount package supports high-density PCB layouts while preserving thermal and electrical performance expected for commercial deployments.
- Clear Specification Set — Detailed datasheet and device handbook coverage for operating conditions, DC and switching characteristics, and power consumption helps streamline validation and system integration.
- RoHS Compliant — Meets environmental compliance for lead-free manufacturing processes.
Why Choose EP4CE40F29C7N?
The EP4CE40F29C7N positions itself as a practical, commercially graded Cyclone IV FPGA for designs that require a substantial programmable logic resource, significant on-chip memory, and a large number of I/Os in a single compact package. Its documented electrical, thermal, and I/O characteristics support predictable integration into commercial embedded systems.
This device is well-suited for engineering teams building configurable digital logic, interface adapters, or control systems where reprogrammability, I/O density, and on-chip memory reduce external components and accelerate development cycles.
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