EP4CE40F29C8L

The EP4CE40F29C8L is an Intel Cyclone® IV field programmable gate array (FPGA) offered in a 780-ball FBGA package. It provides reconfigurable logic resources, on-chip memory, and a high-density I/O complement for embedded and system-level designs that require flexible hardware implementation.

With 39,600 logic elements and approximately 1.16 Mbits of embedded RAM, this commercial-grade device targets applications that need a balance of logic capacity, memory, and I/O integration within a compact surface-mount package.

Key Features

• Logic Capacity — 39,600 logic elements to implement complex digital functions, custom peripherals, and control logic.
• Embedded Memory — Approximately 1.16 Mbits of on-chip RAM for buffers, FIFOs, and small data stores close to logic.
• High I/O Count — 532 I/O pins to support dense external interfacing and multiple parallel buses.
• Package and Mounting — 780-FBGA (29 × 29) package case (780-BGA) designed for surface-mount assembly.
• Core Supply Voltage — Core operating voltage range of 0.970 V to 1.03 V to match system power rails and on-board regulators.
• Operating Temperature — Commercial temperature rating from 0 °C to 85 °C for typical commercial environments.
• Environmental Compliance — RoHS-compliant component suitable for lead-free manufacturing processes.

Typical Applications

• Embedded Systems — Implement custom processing, glue logic, and peripheral controllers where reconfigurable hardware is required.
• Communications & Networking — Support protocol bridging, packet processing, and interface adaptation using abundant logic and I/O.
• Prototyping and Development — Rapid hardware validation and iterative design using a programmable logic fabric with significant resources.
• High-Density I/O Interfaces — Drive multiple external buses and sensors leveraging the 532 I/O pins for complex interconnects.

Unique Advantages

• Substantial Logic Resources: 39,600 logic elements enable implementation of complex logic blocks without immediate need for external ASICs.
• On-Chip Memory Availability: Approximately 1.16 Mbits of embedded RAM reduces dependence on external memory for buffering and local data storage.
• High External Connectivity: 532 I/O pins provide flexibility for interfacing with multiple peripherals, sensors, and parallel buses.
• Compact Surface-Mount Package: 780-FBGA (29 × 29) keeps board area efficient while supporting high pin count for dense designs.
• Controlled Core Voltage: A narrow core supply range (0.970 V–1.03 V) simplifies power rail design for the device core.
• Commercial Temperature Rating and RoHS Compliance: Ready for standard commercial deployments while meeting lead-free manufacturing requirements.

Why Choose EP4CE40F29C8L?

The EP4CE40F29C8L positions itself as a versatile Cyclone IV FPGA option that balances logic density, embedded memory, and high I/O capacity within a compact 780-FBGA surface-mount package. Its specifications make it suitable for designers seeking reconfigurable hardware for commercial embedded systems, communication subsystems, and prototype platforms.

Backed by Cyclone IV device documentation and Intel’s FPGA family, the part offers a known device architecture with clear electrical and thermal limits (0.97–1.03 V core, 0 °C–85 °C operating range) to aid system-level planning and integration.

Request a quote or submit an inquiry for pricing and availability to evaluate EP4CE40F29C8L for your next design.