EP4CE40F29C8LN

The EP4CE40F29C8LN is a Cyclone® IV family FPGA offering programmable digital logic with a high I/O count and substantial on‑chip memory. Built for commercial applications, this device combines 39,600 logic elements across 2,475 configurable logic blocks (CLBs) with extensive I/O connectivity to support complex custom logic implementations.

Key attributes include approximately 1.16 Mbits of embedded memory, support for up to 532 I/O pins, and a compact 780‑FBGA (29 × 29) surface‑mount package. The device operates from a core supply range of 970 mV to 1.03 V and across a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  39,600 logic elements implemented across 2,475 configurable logic blocks (CLBs) to support mid‑range to complex custom digital designs.
• Embedded Memory  Approximately 1.16 Mbits (1,161,216 bits) of on‑chip RAM to accommodate buffering, FIFOs, and local data storage.
• I/O Capacity  Up to 532 general‑purpose I/O pins, enabling high‑pin‑count interfaces and multi‑bus connectivity.
• Power  Core voltage supply range from 970 mV to 1.03 V to match typical Cyclone IV core requirements.
• Package & Mounting  780‑BGA (supplier package: 780‑FBGA, 29×29) in a surface‑mount form factor for compact board integration.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Custom Digital Logic  Implement state machines, datapaths, and glue logic where a mid‑range logic element count and flexible routing are required.
• High‑Pin‑Count Interfaces  Serve as an I/O hub or protocol bridge for systems needing extensive external connectivity through up to 532 I/O pins.
• On‑Chip Buffering and Memory Management  Use the approximately 1.16 Mbits of embedded memory for buffering, FIFOs, and local data handling in streaming or packetized applications.
• Board‑Level Integration  Compact 780‑FBGA package and surface‑mount mounting simplify integration into space‑constrained PCBs.

Unique Advantages

• High Logic Density: 39,600 logic elements across 2,475 CLBs enable implementation of sizable digital functions without external glue logic.
• Substantial On‑Chip RAM: Approximately 1.16 Mbits of embedded memory reduces reliance on external memory for many buffering and local storage tasks.
• Extensive I/O Connectivity: 532 I/O pins allow direct interfacing to multiple peripherals and buses, simplifying system partitioning.
• Compact BGA Packaging: 780‑FBGA (29×29) keeps board footprint small while providing dense pinout for complex designs.
• Commercial‑Grade Operation: Rated for 0 °C to 85 °C operation to match a wide range of standard commercial applications.
• RoHS Compliant: Environmentally compliant for designs requiring lead‑free manufacturing flows.

Why Choose EP4CE40F29C8LN?

The EP4CE40F29C8LN delivers a balanced combination of logic capacity, embedded memory, and I/O density in a compact 780‑BGA package, making it well suited for commercial‑grade designs that demand programmable, board‑level digital logic. Its Cyclone IV architecture provides a known FPGA foundation with clearly defined operating and packaging characteristics.

Choose this device for designs that require scalable on‑chip resources, extensive external connectivity, and a compact surface‑mount footprint—benefits that help simplify BOMs, reduce board complexity, and accelerate time to prototype and deployment.

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