EP4CE40F29C8

The EP4CE40F29C8 is an Intel Cyclone® IV E field-programmable gate array supplied in a 780-ball FBGA (29×29) surface-mount package. It provides a balance of on-chip logic, embedded memory, and I/O capacity for commercial-grade embedded designs.

Key device parameters include 39,600 logic elements, approximately 1.16 Mbits of embedded memory (1,161,216 bits), 532 user I/O pins, a core supply range of 1.15 V to 1.25 V, and an operating temperature range of 0 °C to 85 °C. The device is RoHS-compliant and documented in the Cyclone IV device handbook.

Key Features

• Core Logic

  Provides 39,600 logic elements to implement complex combinational and sequential logic within a single FPGA fabric.

• Embedded Memory

  Includes approximately 1.16 Mbits of on-chip RAM (1,161,216 bits) for buffering, FIFOs, and local data storage.

• I/O Capacity

  Offers 532 device I/O pins to support high-pin-count interface requirements and flexible board-level connectivity.

• Power and Supply

  Core supply voltage range is 1.15 V to 1.25 V, enabling integration with system power rails designed to this nominal range.

• Package and Mounting

  Delivered in a 780-ball FBGA (29×29) surface-mount package (780-BGA package case) for compact, high-density board layouts.

• Operating Range

  Commercial-grade device rated for operation from 0 °C to 85 °C.

• Environmental Compliance

  Manufactured to be RoHS-compliant.

Typical Applications

• Interface and I/O Expansion

  High I/O count (532 pins) supports applications requiring multiple parallel or mixed-signal interface connections and protocol bridging.

• Embedded Control and State Machines

  39,600 logic elements enable implementation of control logic, sequencers, and custom finite-state machines for commercial embedded systems.

• Local Data Buffering

  Approximately 1.16 Mbits of on-chip RAM provide on-device buffering and temporary storage for data streams and processing pipelines.

Unique Advantages

• High Logic Density:

  39,600 logic elements allow consolidation of discrete logic into a single programmable device, reducing board-level complexity.

• Substantial On-Chip Memory:

  Approximately 1.16 Mbits of embedded RAM supports local buffering and accelerates data-handling tasks without immediate external memory.

• Extensive I/O Resources:

  532 I/O pins deliver broad external connectivity for peripherals, sensors, and interface logic.

• Compact, High-Density Packaging:

  780-FBGA (29×29) surface-mount package enables compact board designs while supporting the device’s pin count.

• Commercial Temperature Rating:

  Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial embedded environments.

• Regulatory Compliance:

  RoHS-compliant manufacturing supports environmentally conscious product requirements.

Why Choose EP4CE40F29C8?

The EP4CE40F29C8 combines a substantial logic fabric (39,600 logic elements), meaningful on-chip memory (approximately 1.16 Mbits), and a high I/O count (532 pins) in a single, commercial-grade Cyclone IV E FPGA. Its 780-FBGA (29×29) surface-mount package and defined core supply range (1.15 V to 1.25 V) make it straightforward to integrate into designs requiring compact form factor and high connectivity.

This part is suited to engineers designing commercial embedded systems that require flexible programmable logic, local data storage, and multiple external interfaces, all backed by the Cyclone IV device documentation for detailed electrical and timing characteristics.

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