EP4CE40F29I7

The EP4CE40F29I7 is an Intel Cyclone® IV E Field Programmable Gate Array (FPGA) supplied in a 780‑ball FBGA (29 × 29) package. This industrial‑grade, surface‑mount FPGA integrates a substantial logic fabric, abundant I/O, and embedded RAM to address medium‑density programmable logic needs.

With 39,600 logic elements, approximately 1.16 Mbits of on‑chip RAM, and 532 I/O pins, the device targets applications that require high I/O density, configurable logic capacity, and operation across a wide temperature range. The device operates on a core voltage between 1.15 V and 1.25 V and is RoHS compliant.

Key Features

• Logic Capacity  Provides 39,600 logic elements to implement custom digital logic and function partitioning across the FPGA fabric.
• Logic Array Blocks  Contains 2,475 logic array blocks (LABs), enabling structured placement of logic resources.
• Embedded Memory  Approximately 1.16 Mbits of on‑chip RAM for local buffering, FIFOs, and small LUT‑based memory structures.
• I/O Density  Up to 532 general‑purpose I/O pins to support broad peripheral and interface connectivity.
• Power and Core Voltage  Specified core supply range of 1.15 V to 1.25 V for core power planning and regulator selection.
• Package and Mounting  780‑FBGA (29 × 29) package, surface‑mount mounting type for compact board integration.
• Operating Environment  Industrial operating temperature range from −40 °C to 100 °C to support demanding thermal conditions.
• Regulatory Compliance  RoHS compliant for lead‑free assembly and regulatory alignment.
• Documented Device Handbook  Cyclone IV device handbook documentation covers operating conditions, absolute maximum ratings, recommended operating conditions, DC and switching characteristics, and other device‑level specifications.

Typical Applications

• Embedded Control and Logic  Programmable system control, glue logic, and state‑machine implementations that leverage the device’s 39,600 logic elements.
• High‑Density I/O Interfaces  I/O‑intensive designs requiring many parallel or multiplexed interfaces benefit from the device’s 532 available I/O pins.
• On‑Chip Memory Usage  Applications that need local buffering or small data stores can use approximately 1.16 Mbits of embedded RAM for FIFOs, look‑aside buffers, and scratch memory.
• Industrial Systems  Industrial applications that require operation across −40 °C to 100 °C and surface‑mount packaging for compact assemblies.

Unique Advantages

• High Logic Density:  39,600 logic elements support significant custom logic integration while keeping design consolidation on a single FPGA.
• Large I/O Count:  532 I/O pins simplify direct interfacing to multiple peripherals and parallel buses, reducing external glue logic.
• On‑Chip Memory:  Approximately 1.16 Mbits of embedded RAM reduce dependence on external memory for small buffering and latency‑sensitive data paths.
• Industrial Temperature Range:  Rated for −40 °C to 100 °C to meet the environmental demands of industrial deployments.
• Compact BGA Packaging:  780‑FBGA (29 × 29) package offers a compact footprint for space‑constrained boards while supporting high pin counts.
• Standards‑ready Compliance:  RoHS compliance supports lead‑free assembly processes and regulatory requirements.

Why Choose EP4CE40F29I7?

The EP4CE40F29I7 Cyclone IV E FPGA from Intel combines a sizeable logic fabric, substantial embedded memory, and a high I/O count in a compact 780‑ball FBGA package. Its industrial temperature rating and RoHS compliance make it suitable for medium‑density programmable logic tasks where environmental robustness and board‑level integration matter.

This device is well suited to engineers designing systems that require consolidated logic, extensive peripheral connectivity, and on‑chip memory for buffering or control functions. The Cyclone IV device handbook provides detailed electrical and performance specifications to support system design and validation.

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