EP4CE40F29I8L

The EP4CE40F29I8L is a Cyclone® IV E Field Programmable Gate Array (FPGA) IC from Intel, offered in a 780-FBGA (29×29) package. It provides a balance of configurable logic, on-chip memory, and a high I/O count, tailored for industrial and embedded designs that require reprogrammable digital logic.

With 39,600 logic elements, approximately 1.16 Mbits of embedded RAM, and a wide operating temperature range, this device is suitable for applications that need significant on-chip logic capacity and robust environmental performance.

Key Features

• Logic Capacity  Approximately 39,600 logic elements to implement complex digital functions and custom hardware logic.
• Logic Array Blocks  2,475 logic array blocks for structured resource allocation across designs.
• Embedded Memory  Approximately 1.16 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• I/O Resources  532 general-purpose I/O pins to interface with peripherals, sensors, and external logic.
• Core Supply Voltage  Core voltage range of 0.97 V to 1.03 V for the device core power domain.
• Package and Mounting  780-ball FBGA (29×29) in a surface-mount form factor for compact board integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for use in industrial environments.
• RoHS Compliant  Manufactured in accordance with RoHS requirements.

Typical Applications

• Industrial Automation and Control  Implement custom control logic, timing, and interface glue in industrial systems using the device’s large logic capacity and industrial temperature rating.
• Communications and Networking  Use the high I/O count to connect transceivers, PHYs, and peripheral interfaces for packet processing or protocol bridging.
• Instrumentation and Test Equipment  Leverage on-chip RAM and abundant logic to build data acquisition, preprocessing, and real-time analysis functions within measurement systems.
• Embedded System Prototyping  Deploy as a reprogrammable platform to validate custom digital architectures and accelerate hardware/software co-development.

Unique Advantages

• High Logic Density:  Approximately 39,600 logic elements provide room for complex designs without immediate need for multi-device partitioning.
• Generous I/O Count:  532 I/Os make it easier to integrate multiple peripherals and high-pin-count interfaces directly on a single device.
• On-Die Memory:  Approximately 1.16 Mbits of embedded RAM enables local buffering and state retention for high-throughput tasks.
• Industrial Reliability:  Rated for −40 °C to 100 °C operation to withstand a wide range of field conditions common in industrial deployments.
• Compact, Surface-Mount Packaging:  780-FBGA (29×29) allows dense PCB layouts and supports volume assembly processes.
• Standards-Compliant Manufacturing:  RoHS-compliant construction aligns with common environmental requirements.

Why Choose EP4CE40F29I8L?

The EP4CE40F29I8L brings a balanced mix of logic capacity, embedded memory, and extensive I/O in a compact 780-FBGA package, positioned for industrial and embedded applications that require configurable hardware resources. Its core supply range and documented Cyclone IV family specifications provide clear electrical and operational parameters for reliable system integration.

Engineers and system designers will find this device suitable for projects that demand substantial on-chip logic, robust thermal performance, and flexible interfacing options, supported by Cyclone IV device documentation from the manufacturer.

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