EP4CE55F23A7N

The EP4CE55F23A7N is a Cyclone® IV E field programmable gate array (FPGA) provided in a 484-ball FBGA (23 × 23 mm) package. It delivers 55,856 logic elements, approximately 2.396 Mbits of embedded memory, and 324 user I/Os in a surface-mount package.

Designed and qualified for automotive use with AEC-Q100 certification, the device supports a 1.15 V to 1.25 V core supply and an extended operating temperature range of −40°C to 125°C, addressing application needs where high integration, broad I/O count, and rugged temperature performance are required.

Key Features

• Core Logic 55,856 logic elements for implementing complex programmable logic and custom hardware functions.
• Embedded Memory Approximately 2.396 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage.
• I/O Capacity 324 user I/Os to interface with sensors, actuators, and peripheral devices in dense systems.
• Power Supply Low-voltage core operation with a 1.15 V to 1.25 V supply range to support power-optimized designs.
• Package & Mounting 484-FBGA (23 × 23) surface-mount package providing a compact footprint for board-level integration.
• Automotive Qualification AEC-Q100 qualification and automotive grade designation for use in demanding vehicle environments.
• Temperature Range Qualified for operation from −40°C to 125°C to meet extended-temperature application requirements.
• Compliance RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• Automotive Electronic Subsystems — Integration into vehicle electronic modules requiring AEC-Q100 qualification and extended temperature operation.
• In-vehicle Interface and Bridging — High I/O count supports protocol bridging and signal routing between sensors and controllers.
• Embedded Signal Processing — On-chip memory and extensive logic resources enable local data processing and buffering in compact designs.

Unique Advantages

• High Logic Density: 55,856 logic elements enable implementation of substantial custom logic without external ASICs.
• Substantial On-chip Memory: Approximately 2.396 Mbits of embedded RAM simplifies data buffering and reduces external memory dependence.
• Large I/O Count: 324 user I/Os provide flexibility for complex system interfacing and multi-channel connectivity.
• Automotive Qualification: AEC-Q100 certified and automotive grade for deployment in vehicle electronic environments.
• Extended Temperature Capability: −40°C to 125°C rating supports designs that must operate across wide thermal ranges.
• Compact FBGA Package: 484-ball 23 × 23 mm FBGA balances high integration with a board-friendly footprint.

Why Choose EP4CE55F23A7N?

The EP4CE55F23A7N positions itself as a rugged, high-density FPGA option for applications that require significant programmable logic, substantial embedded memory, and a high I/O count in a compact surface-mount package. Its AEC-Q100 qualification and wide operating temperature range make it suitable for automotive electronic subsystems and other environments requiring robust thermal performance.

Engineers seeking a scalable, verified platform for in-vehicle processing, interface bridging, or embedded signal handling will find the combination of logic capacity, on-chip RAM, and automotive qualification beneficial for reducing system complexity and supporting long-term deployment.

Request a quote or submit an inquiry to receive pricing, lead-time, and availability details for the EP4CE55F23A7N. Our team can assist with ordering and technical questions to support your design requirements.