EP4CE55F23C6N

The EP4CE55F23C6N is a Cyclone® IV Field Programmable Gate Array (FPGA) IC from Intel. It provides reprogrammable digital logic with 55,856 logic elements and approximately 2.4 Mbits of embedded RAM in a high-density 484‑BGA package.

Designed for commercial‑grade applications, this surface‑mount FPGA offers a wide set of on‑chip resources and I/O density for mid‑range digital designs that require flexible logic, embedded memory, and a compact footprint.

Key Features

• Core Logic  55,856 logic elements delivered for implementing complex digital functions and control logic.
• Embedded Memory  Approximately 2.4 Mbits of on‑chip RAM to support buffering, state machines, and local data storage.
• I/O Density  324 I/O pins to accommodate a variety of peripheral interfaces and bus connections.
• Power Supply  Core operating voltage range of 1.15 V to 1.25 V for the device core.
• Package & Mounting  484‑ball BGA (484‑FBGA, 23×23) in a surface‑mount package for compact board integration.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards & Documentation  RoHS‑compliant material status; detailed device specifications (operating conditions, DC characteristics, switching characteristics and more) are provided in the Cyclone IV device handbook and datasheet.

Typical Applications

• Commercial Embedded Systems  Reprogrammable logic for control, glue logic, and feature upgrades in commercial equipment.
• Data Buffering and Local Processing  Use embedded RAM and logic elements for data path buffering, packet handling, or intermediate processing.
• Interface Aggregation  High I/O count enables aggregation and translation between multiple digital interfaces on a single device.

Unique Advantages

• Substantial Logic Capacity:  55,856 logic elements enable implementation of sizable custom logic blocks without external ASICs.
• On‑Chip Memory Resource:  Approximately 2.4 Mbits of embedded RAM reduces the need for external memory for many buffering and stateful tasks.
• High I/O Throughput:  324 I/Os provide flexibility to connect multiple peripherals, buses, and external devices directly to the FPGA.
• Compact, Surface‑Mount Package:  484‑FBGA (23×23) package supports dense PCB layouts while retaining robust signal routing options.
• Commercial Operating Range:  Rated for 0 °C to 85 °C to meet commercial application environment requirements.
• Compliance and Documentation:  RoHS compliance and a comprehensive device handbook/datasheet that includes operating conditions, electrical characteristics, and reliability‑related specifications.

Why Choose EP4CE55F23C6N?

The EP4CE55F23C6N positions itself as a capable, commercial‑grade FPGA for designers who need a balance of logic density, embedded memory, and I/O connectivity in a compact BGA package. Its specification set supports a wide range of mid‑range digital designs where reprogrammability and on‑chip resources reduce system complexity.

With detailed device documentation available for operating conditions, DC and switching characteristics, and packaging information, the EP4CE55F23C6N is suitable for teams that require verifiable electrical specifications and clear integration guidance during development.

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