EP4CE55F23C8

The EP4CE55F23C8 is a Cyclone® IV E field programmable gate array (FPGA) from Intel, supplied in a 484-ball BGA package. It delivers a balance of programmable logic capacity, embedded memory, and a high I/O count for commercial embedded designs.

With 55,856 logic elements and approximately 2.4 Mbits of on-chip RAM, this device is suited for commercial applications that require substantial digital integration, flexible I/O routing and a compact surface-mount BGA footprint.

Key Features

• Logic Capacity — 55,856 logic elements for building custom digital functions and implementing complex combinational and sequential logic.
• Embedded Memory — Approximately 2.4 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Density — 324 I/O pins to support multiple interfaces and parallel connections in compact system designs.
• Power and Core Voltage — Core supply range of 1.15 V to 1.25 V, enabling integration into designs with defined core-voltage domains.
• Package & Mounting — 484-FBGA (23 × 23) surface-mount package for high-density board integration and reliable soldered mounting.
• Operating Range — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory — RoHS compliant for lead-free assembly and regulatory alignment in commercial products.
• Technical Documentation — Supporting datasheet and device handbook detail operating conditions, DC characteristics, power and switching specifications to aid system design and validation.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic, state machines and glue logic for compact, board-level designs.
• Prototyping and Development — Evaluate and iterate digital designs that require sizable logic and embedded RAM before production integration.
• Communications and Interface Bridging — Aggregate multiple parallel or serial interfaces using the device’s high I/O count and programmable logic.
• Signal Processing and Data Handling — Local buffering and deterministic logic paths enabled by on-chip RAM and abundant logic elements for commercial equipment.

Unique Advantages

• High Logic Density: 55,856 logic elements provide room to implement complex logic functions on a single device, reducing the need for multiple discrete components.
• Substantial On-Chip Memory: Approximately 2.4 Mbits of embedded RAM supports local buffering and temporary storage, simplifying memory subsystem design.
• Generous I/O Count: 324 I/Os enable flexible interfacing to sensors, peripherals and external buses without extensive routing compromises.
• Compact BGA Package: 484-FBGA (23×23) delivers a small board footprint while maintaining high pin count for dense system integration.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C for deployment in commercial environments where that operating range matches system requirements.
• RoHS Compliant: Supports lead-free manufacturing flows and regulatory compliance for commercial products.

Why Choose EP4CE55F23C8?

The EP4CE55F23C8 positions itself as a versatile, mid-to-high capacity Cyclone IV E FPGA for commercial designs that need a balance of logic resources, embedded memory and I/O flexibility in a compact BGA package. Its documented operating conditions, DC characteristics and power/switching information make it straightforward to evaluate for integration into board-level systems.

This device is well suited to engineers and product teams building commercial embedded systems, communication endpoints, and development platforms that require programmable logic with clear specifications for voltage, temperature and package characteristics, backed by Intel/Altera device documentation.

Request a quote or submit an inquiry to receive pricing, lead-time and availability information for EP4CE55F23C8. Our team can help confirm fit for your design and provide the datasheet and technical materials needed for system integration.