EP4CE55F23C9L

The EP4CE55F23C9L is a Cyclone® IV E Field Programmable Gate Array (FPGA) from Intel, supplied in a 484-FBGA (23×23) package with surface-mount mounting. This device provides 55,856 logic elements, approximately 2.396 Mbits of embedded memory, and up to 324 I/O pins, making it suitable for designs that require significant on-chip logic and memory capacity within a compact BGA footprint.

Key electrical and environmental parameters are documented for system integration: a core voltage supply range of 0.970 V to 1.03 V, a commercial operating temperature range of 0 °C to 85 °C, and RoHS compliance.

Key Features

• Core Logic 55,856 logic elements for implementing complex programmable logic and custom digital functions.
• Embedded Memory Approximately 2.396 Mbits of on-chip RAM to support buffering, state machines, and data storage close to logic.
• I/O Capacity Up to 324 user I/O pins to connect peripherals, buses, and external interfaces directly to the FPGA fabric.
• Package & Mounting 484-BGA physical package (supplier device package: 484-FBGA, 23×23) optimized for surface-mount assembly and compact board integration.
• Supply Voltage Documented core voltage supply range: 0.970 V to 1.03 V, enabling precise power sequencing and design margining.
• Operating Range & Grade Commercial-grade device specified for 0 °C to 85 °C operation.
• Standards & Compliance RoHS-compliant construction for regulatory and manufacturing compatibility.
• Datasheet-backed Specifications Detailed device handbook content available covering operating conditions, absolute maximum ratings, DC characteristics, supply current, power consumption, switching characteristics, I/O standards, and other critical integration details.

Typical Applications

• Designs requiring high on-chip logic density — Systems that need tens of thousands of programmable logic elements and substantial embedded memory can consolidate functions into a single FPGA.
• Multi-I/O system integration — Up to 324 I/O pins enable interfacing with multiple peripherals, buses, and external devices within a compact BGA package.
• Compact-board implementations — The 484-FBGA (23×23) package and surface-mount mounting support space-constrained PCB layouts.

Unique Advantages

• High-density programmable logic: 55,856 logic elements provide capacity for complex custom logic implementations while reducing the need for multiple discrete devices.
• On-chip memory integration: Approximately 2.396 Mbits of embedded RAM minimizes external memory requirements for buffering and local data storage.
• Extensive I/O availability: 324 I/O pins support broad peripheral connectivity without sacrificing board real estate.
• Compact BGA packaging: 484-FBGA (23×23) enables a small PCB footprint with a high pin count for dense designs.
• Documented electrical and thermal parameters: Datasheet excerpts provide detailed operating conditions, DC and switching characteristics, and power consumption data to support reliable integration.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and supply chain requirements.

Why Choose EP4CE55F23C9L?

The EP4CE55F23C9L combines a high logic element count, significant embedded memory, and broad I/O capability in a compact 484-FBGA package, making it a robust choice for applications that require dense programmable logic and integrated memory. Its documented electrical characteristics and commercial operating range support practical system-level integration and predictable behavior across typical deployment environments.

This device is well suited for engineers and purchasers seeking a programmable solution that consolidates multiple digital functions into a single FPGA, simplifies board-level routing with abundant I/O, and benefits from comprehensive datasheet guidance for electrical and thermal design.

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