EP4CE55F23I7N

The EP4CE55F23I7N is an Intel Cyclone IV FPGA in a 484‑ball FBGA (23×23) surface‑mount package. It provides a programmable logic fabric with a large number of logic elements, embedded RAM, and a high pin count for I/O‑intensive designs.

Designed as an industrial‑grade device, this part offers approximately 55,856 logic elements, about 2.4 Mbits of on‑chip RAM, and 324 user I/O pins, making it suitable for embedded systems and control applications that require significant logic capacity and connectivity within a compact BGA footprint.

Key Features

• Logic Capacity  Approximately 55,856 logic elements for implementing complex custom logic, state machines, and datapath functions.
• Embedded Memory  Approximately 2.4 Mbits of on‑chip RAM for buffering, FIFOs, and small data storage close to logic.
• I/O Resources  324 user I/O pins to support wide parallel interfaces, multiple peripherals, or mixed signaling domains.
• Package & Mounting  484‑FBGA (23×23) surface‑mount package for high pin density and compact board integration.
• Power and Voltage  Core supply voltage range of 1.15 V to 1.25 V to match Cyclone IV core requirements.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial environment demands.
• Compliance  RoHS‑compliant manufacturing.
• Datasheet and Technical Reference  Supported by the Cyclone IV Device Handbook and detailed device datasheets covering operating conditions, DC characteristics, I/O standards, power, and timing.

Typical Applications

• Industrial Control and Automation  Use the device’s logic density and industrial temperature rating to implement custom motor control, sequencing, and I/O aggregation functions.
• I/O‑Intensive Interfaces  Leverage 324 I/Os to bridge multiple parallel buses, implement protocol converters, or aggregate sensor and actuator networks.
• Embedded System Acceleration  Deploy logic and on‑chip RAM to offload deterministic processing tasks and real‑time signal handling from a host processor.

Unique Advantages

• High Logic Density:  Approximately 55,856 logic elements enable implementation of substantial custom logic without immediate need to scale to larger device families.
• Integrated Memory for Local Buffering:  About 2.4 Mbits of embedded RAM reduces external memory dependence for many common buffering and streaming tasks.
• Large I/O Count:  324 user I/Os support multi‑channel interfaces and complex peripheral connectivity in a single device.
• Industrial Robustness:  Temperature rating from −40 °C to 100 °C and industrial grade designation provide operational headroom for harsh environments.
• Compact, High‑Density Package:  484‑FBGA (23×23) lets you pack high capability into space‑constrained PCBs while maintaining routing and grounding options expected for BGA integration.
• Documented Electrical and Timing Guidance:  Device documentation includes operating conditions, DC specs, I/O standards, power, and switching characteristics to support predictable designs.

Why Choose EP4CE55F23I7N?

The EP4CE55F23I7N combines substantial programmable logic capacity, embedded memory, and a high I/O count in an industrial‑grade Cyclone IV FPGA package. It is well suited for engineers who need a compact, documented FPGA solution capable of handling complex logic, wide connectivity, and on‑chip buffering within a single device.

This part is appropriate for design teams targeting embedded control, I/O aggregation, and deterministic hardware acceleration, offering a balance of integration and rugged operating range backed by Cyclone IV device documentation.

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