EP4CE55F23I7

The EP4CE55F23I7 is a Cyclone IV E Field Programmable Gate Array (FPGA) in a 484-FBGA (23×23) surface-mount package. It provides a high-density logic fabric with 55,856 logic elements and approximately 2.396 Mbits of embedded memory, enabling substantial on-chip integration.

Designed for industrial-grade operation, the device offers 324 I/O pins, a core supply range of 1.15 V to 1.25 V, and an operating temperature range of –40 °C to 100 °C. Documentation and device specifications are supported by the Cyclone IV Device Handbook from Altera/Intel.

Key Features

• Core Logic  55,856 logic elements provide dense programmable logic capacity for complex designs.
• Embedded Memory  Approximately 2.396 Mbits of on-chip RAM for buffering, state storage, and memory-mapped logic functions.
• I/O Capability  324 general-purpose I/O pins accommodate extensive external interfacing and board-level connectivity.
• Power  Core voltage supply range of 1.15 V to 1.25 V to match system power architectures and device requirements.
• Package  484-FBGA (23×23) package in a surface-mount format for compact, high-density PCB implementations.
• Temperature and Grade  Industrial grade device with an operating temperature range from –40 °C to 100 °C for robust environmental performance.
• Compliance  RoHS-compliant construction supports regulatory and environmental requirements.

Typical Applications

• Industrial Control Systems  Industrial-grade temperature range and high logic density support control, sequencing, and interface functions in industrial equipment.
• High‑Density I/O Designs  324 I/O pins enable board-level designs that require many external connections or diverse signaling.
• Embedded Memory‑Intensive Logic  Approximately 2.396 Mbits of on-chip RAM are suitable for designs that need local buffering, FIFOs, or state storage within the FPGA fabric.

Unique Advantages

• High Logic Capacity: 55,856 logic elements provide the headroom to implement complex, multi-function designs on a single device.
• Substantial On‑Chip Memory: Approximately 2.396 Mbits of embedded RAM reduce external memory dependencies and simplify board design.
• Generous I/O Count: 324 I/O pins give flexibility for connecting sensors, interfaces, and peripherals without additional I/O expanders.
• Industrial Operating Range: Rated from –40 °C to 100 °C to meet demanding temperature requirements in industrial environments.
• Compact, Surface‑Mount Package: 484-FBGA (23×23) minimizes PCB area while supporting high pin count and reliable assembly.
• Standards and Documentation: RoHS compliance and support from the Cyclone IV Device Handbook provide clear design guidance and regulatory alignment.

Why Choose EP4CE55F23I7?

The EP4CE55F23I7 combines high logic element count, substantial embedded memory, and a large I/O complement in a compact 484-FBGA surface-mount package. Its industrial-grade temperature range and defined core voltage make it suitable for designs that require reliable, reconfigurable logic with significant on-chip resources.

Supported by Cyclone IV device documentation from Altera/Intel, this FPGA is appropriate for engineering teams seeking a documented, high-density programmable device for industrial and complex embedded applications where integration and on-chip memory reduce system complexity.

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