EP4CE55F23C9LN

The EP4CE55F23C9LN is a Cyclone® IV E field programmable gate array (FPGA) from Intel, offered in a 484-FBGA (23×23) package. It provides substantial programmable logic capacity and on-chip memory for compact, configurable digital designs.

With 55,856 logic elements, approximately 2.4 Mbits of embedded RAM and up to 324 I/Os, this device targets applications that require dense logic integration, flexible I/O routing and low-voltage core operation within a commercial temperature range.

Key Features

• FPGA Core – Cyclone IV E Field programmable gate array architecture from Intel’s Cyclone IV E family; refer to the Cyclone IV Device Handbook for detailed device-level specifications and operating conditions.
• Logic Capacity 55,856 logic elements provide substantial resources for implementing custom digital logic, finite state machines and glue logic.
• On‑Chip Memory Approximately 2.4 Mbits of embedded RAM to support buffers, FIFOs and small data stores within the fabric.
• I/O Density Up to 324 I/O pins to accommodate multiple external interfaces and high-density board-level integration.
• Power Core voltage supply specified from 0.97 V to 1.03 V for low-voltage operation and predictable power planning.
• Package & Mounting 484-FBGA (23×23) package in a surface-mount form factor for compact PCB designs.
• Temperature & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant to support lead‑free assembly and regulatory requirements.

Typical Applications

• Custom digital logic and prototyping Implement and iterate bespoke logic functions using abundant logic elements and embedded RAM.
• High‑density I/O interfacing Consolidate multiple external interfaces with the device’s up to 324 I/Os to simplify board-level connectivity.
• System glue and peripheral integration Integrate custom peripherals, protocol bridges or control logic within a single programmable device.

Unique Advantages

• High logic capacity: 55,856 logic elements enable complex designs without external ASICs.
• Embedded memory on package: Approximately 2.4 Mbits of RAM reduces dependence on external memory for mid‑size buffering and storage.
• Flexible I/O count: Up to 324 I/Os allow for dense connectivity and consolidation of multiple board-level signals.
• Compact surface-mount package: The 484-FBGA (23×23) package supports space-constrained PCB layouts while retaining high pin count.
• Controlled core voltage: Narrow supply window (0.97–1.03 V) simplifies power-supply design for the FPGA core.
• Commercial temperature rating: Rated 0 °C to 85 °C for a wide range of commercial and consumer system environments.

Why Choose EP4CE55F23C9LN?

The EP4CE55F23C9LN combines a high logic element count, meaningful on-chip RAM and a large I/O complement in a compact 484-FBGA package—delivering a balance of integration and board-area efficiency for programmable digital designs. Its Cyclone IV E architecture and accompanying device handbook documentation provide the technical detail needed for implementation and system-level planning.

This device is well suited for developers and teams building commercial-grade systems that require configurable logic, embedded memory and dense I/O in a surface-mount package. Its electrical and thermal parameters support predictable system design and supply-chain planning backed by Intel’s Cyclone IV device documentation.

Request a quote or submit an inquiry to receive pricing and availability information for EP4CE55F23C9LN and to discuss how it fits your next design.