EP4CE55F23I8LN

The EP4CE55F23I8LN is a Cyclone IV E field programmable gate array (FPGA) supplied in a 484-ball FBGA package (23×23). It delivers a combination of programmable logic, embedded memory, and a dense I/O count for complex digital designs.

With 55,856 logic elements, approximately 2.396 Mbits of on-chip RAM and 324 I/Os, this device is intended for designs that require substantial programmable logic capacity, embedded memory resources, and a wide range of external signal connectivity while meeting industrial temperature requirements.

Key Features

• Core Logic  55,856 logic elements provide substantial on-chip programmable logic resources for implementing complex digital functions.
• Embedded Memory  Approximately 2.396 Mbits of total RAM bits for on-chip buffering, state storage, and small data structures.
• I/O Capacity  324 general-purpose I/Os to connect a variety of external devices, buses, and peripherals.
• Power Supply  Core voltage operating range of 0.970 V to 1.030 V, suitable for the device’s specified operating conditions.
• Package & Mounting  484-ball FBGA package (484-BGA, 23×23); surface-mount package for compact PCB integration.
• Operating Temperature  Rated for industrial temperature operation from −40 °C to 100 °C.
• Standards & Compliance  RoHS-compliant construction supports regulatory environmental requirements.
• Documentation  Device datasheet and Cyclone IV Device Handbook provide detailed operating conditions, DC characteristics, switching characteristics, I/O standards, and power/supply specifications.

Typical Applications

• Programmable Logic Integration  Implement glue logic, custom finite state machines, and protocol conversion functions using the device’s logic and memory resources.
• High‑I/O Control  Drive and interface large numbers of external signals or parallel buses using the 324 available I/Os.
• Embedded Buffering and Data Handling  Use the on-chip RAM for buffering and temporary data storage close to programmable logic.
• Industrial‑Temperature Systems  Deploy in environments requiring operation from −40 °C to 100 °C where industrial-grade temperature range is required.

Unique Advantages

• Substantial Logic Capacity: 55,856 logic elements enable consolidation of multiple digital functions into a single device, reducing external components.
• On‑Chip Memory Resources: Approximately 2.396 Mbits of RAM provides local storage for buffering, lookup tables, and control-state data without external memory dependence.
• High I/O Count: 324 I/Os allow flexible interfacing with sensors, peripherals, and parallel interfaces, simplifying board-level design.
• Industrial Temperature Rating: Certified operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
• Compact Surface-Mount Package: The 484-FBGA (23×23) package supports dense PCB implementation for space-constrained designs.
• Standards Compliance: RoHS compliance aids in meeting environmental and regulatory requirements for assembly.

Why Choose EP4CE55F23I8LN?

The EP4CE55F23I8LN offers a balanced mix of programmable logic, embedded memory, and a high I/O count in a compact 484-FBGA package, targeted at designs that need significant on-chip logic and connectivity while operating across an industrial temperature range. Its documented device specifications, including supply and operating conditions, support careful system-level integration and reliable operation.

This device is well suited for engineering teams looking to integrate multiple digital functions on a single FPGA, reduce external component count, and maintain robust operation in industrial-temperature environments. Detailed device and handbook documentation is available for implementation and design verification.

Request a quote or submit an inquiry to obtain pricing and availability for EP4CE55F23I8LN and to discuss how it fits your project requirements.