EP4CE55F29C7N

The EP4CE55F29C7N is a Cyclone IV E field programmable gate array (FPGA) IC from Intel, provided in a 780‑FBGA (29×29) surface‑mount package. It is a commercial‑grade device designed for board‑level integration where a high count of logic elements, on‑chip memory, and flexible I/O are required.

With 55,856 logic elements, approximately 2.40 Mbits of embedded memory, and up to 374 I/O pins, this device targets designs that need substantial programmable logic density and broad external connectivity while operating within a 1.15 V to 1.25 V core supply range and a 0 °C to 85 °C operating window.

Key Features

• Core Logic  55,856 logic elements for implementing complex digital functions and custom logic blocks.
• Embedded Memory  Approximately 2.40 Mbits of on‑chip RAM to support buffering, state storage, and data processing close to the logic fabric.
• I/O Capacity  Up to 374 user I/O pins to enable wide peripheral and bus interfacing from a single device.
• Package & Mounting  780‑ball FBGA (29×29) in a surface‑mount package for high pin‑count board designs and compact footprint integration.
• Power Supply  Core voltage specified from 1.15 V to 1.25 V to match target system power architectures.
• Operating Temperature  Commercial grade operation from 0 °C to 85 °C for standard environmental deployments.
• Regulatory Compliance  RoHS‑compliant construction to support modern, restricted‑substance manufacturing requirements.
• Documented Series Support  Part of the Cyclone IV device family with supporting technical documentation and device handbook references supplied by the manufacturer.

Typical Applications

• High‑density logic implementations  Use the 55,856 logic elements to realize complex finite‑state machines, protocol engines, and custom accelerators.
• Memory‑assisted data handling  Leverage approximately 2.40 Mbits of embedded RAM for packet buffering, small caches, or streaming data staging close to logic.
• Board‑level interfacing and bridging  The 374 I/O pins enable parallel buses, multi‑channel sensor interfaces, and protocol bridging between subsystems.
• Compact, high‑pin‑count designs  The 780‑FBGA (29×29) package supports dense board layouts where pin count and footprint efficiency are priorities.

Unique Advantages

• High logic capacity: 55,856 logic elements allow implementation of sizable custom logic and multiple concurrent functions within one device.
• Integrated on‑chip memory: Approximately 2.40 Mbits of embedded RAM reduces dependence on external memory for many buffering and temporary storage needs.
• Extensive I/O flexibility: 374 available I/Os provide direct connectivity to a wide range of peripherals and interfaces without multiplexing compromises.
• Commercial‑grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliance, making it suitable for mainstream electronic products and prototypes.
• Compact, production‑ready packaging: The 780‑FBGA format supports high pin counts in a compact surface‑mount form factor for modern PCB assembly.

Why Choose EP4CE55F29C7N?

The EP4CE55F29C7N positions itself as a high‑density Cyclone IV E FPGA option for commercial designs that require a combination of significant logic resources, embedded RAM, and wide I/O capability in a compact 780‑FBGA package. Its documented device family and manufacturer references support design integration, verification, and long‑term supply planning.

This device is well suited to system designers and engineers building complex control logic, data‑handling blocks, or multi‑interface boards who need a single FPGA that balances logic capacity, on‑chip memory, and I/O count within standard commercial operating conditions.

Request a quote or submit a purchase inquiry today to learn about availability, pricing, and lead times for the EP4CE55F29C7N.