EP4CE55F29C8

The EP4CE55F29C8 is an Intel Cyclone® IV E field programmable gate array (FPGA) offered in a 780-ball FBGA (29 × 29) package. It provides a mid-range logic resource and I/O count suitable for commercial electronic designs that require flexible programmable logic and on-chip memory.

This device integrates 55,856 logic elements, approximately 2.4 Mbits of embedded RAM, and 374 user I/O pins, and operates from a 1.15 V to 1.25 V core supply within a commercial temperature range of 0 °C to 85 °C. The part is RoHS compliant and intended for surface-mount assembly in a 780-BGA package.

Key Features

• Core Logic  55,856 logic elements for implementing medium-density programmable logic and custom hardware functions.
• Embedded Memory  Approximately 2.4 Mbits of on-chip RAM to support buffering, FIFOs, and data-path storage.
• I/O Capacity  374 user I/O pins to interface with external peripherals, sensors, and system buses.
• Package  780-ball FBGA (29 × 29) surface-mount package (780-BGA) for compact PCB integration.
• Power  Core supply voltage range of 1.15 V to 1.25 V to match system power budgeting and FPGA core requirements.
• Operating Range  Commercial grade operation from 0 °C to 85 °C for typical commercial embedded environments.
• Compliance  RoHS compliant manufacturing and materials.

Typical Applications

• Commercial Embedded Systems  Implement control logic, protocol bridging, and mid-density custom processing using the device’s logic elements and on-chip RAM.
• Communications and Interface Gateways  Use the 374 I/O pins to implement multi-channel interfaces, protocol adaptation, and I/O aggregation in commercial products.
• Prototyping and Development  Leverage the Cyclone IV E architecture and substantial logic resources for proof-of-concept designs and iterative hardware development.

Unique Advantages

• High Logic Capacity: 55,856 logic elements enable sizable custom logic implementations without moving to larger device families.
• Significant On-Chip Memory: Approximately 2.4 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-path tasks.
• Extensive I/O Resources: 374 user I/O pins provide flexibility to connect multiple peripherals and system interfaces directly to the FPGA.
• Compact BGA Footprint: The 780-FBGA (29 × 29) package supports dense board-level integration while maintaining robust signal routing.
• Commercial Temperature Grade: Specified for 0 °C to 85 °C operation to match general commercial product environments.
• Standards Compliance: RoHS compliant to meet common regulatory and manufacturing requirements.

Why Choose EP4CE55F29C8?

EP4CE55F29C8 positions itself as a practical Cyclone IV E FPGA option for commercial designs that require a balance of logic density, embedded memory, and abundant I/O in a compact BGA package. Its documented operating and electrical characteristics make it suitable for systems that need deterministic programmable hardware within the specified commercial temperature and voltage ranges.

Backed by the Cyclone IV device handbook and datasheet documentation, this Intel (Altera) device offers a clearly specified platform for engineers and procurement teams seeking predictable device behavior, integration flexibility, and RoHS-compliant manufacturing.

Request a quote for EP4CE55F29C8 to check availability, lead times, and pricing for your next design.