EP4CE55F29C8L

The EP4CE55F29C8L is a Cyclone® IV E Field Programmable Gate Array (FPGA) from Intel. It delivers a programmable logic platform with 55,856 logic elements and extensive I/O capacity in a compact 780-FBGA (29×29) surface-mount package.

Designed for commercial-grade systems, the device provides approximately 2.396 Mbits of embedded memory, a 374-pin I/O count, and documented electrical and timing characteristics in the Cyclone IV Device Handbook. Core supply operation is specified between 0.970 V and 1.030 V, and the device is rated for 0 °C to 85 °C operation.

Key Features

• Logic Capacity — 55,856 logic elements to implement complex digital functions and custom logic architectures.
• Embedded Memory — Approximately 2.396 Mbits of on-chip RAM for buffers, FIFOs, and small data stores.
• I/O Density — 374 general-purpose I/Os to support high-density interfacing and parallel connectivity.
• Package and Mounting — 780-FBGA (29×29) package in a surface-mount form factor for compact board-level integration.
• Power and Voltage — Core supply range 0.970 V to 1.030 V to match system power rails and power-management schemes.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C, suitable for standard commercial electronic products.
• Standards and Compliance — RoHS compliant.
• Documented Electrical and Timing Data — Operating conditions, DC characteristics, switching characteristics, I/O specifications, and other device details are provided in the Cyclone IV Device Handbook.

Typical Applications

• Custom Digital Logic and Prototyping — Use the available 55,856 logic elements to prototype or implement bespoke digital architectures and accelerate time-to-market.
• High-density I/O Control — 374 I/Os enable control and aggregation of numerous parallel interfaces and peripheral signals on a single device.
• Embedded Memory Functions — Approximately 2.396 Mbits of on-chip RAM supports buffering, packet queuing, and small data-store requirements within the FPGA fabric.
• Compact System Integration — The 780-FBGA (29×29) surface-mount package simplifies placement in space-constrained boards while maintaining high integration.

Unique Advantages

• High Logic Density: 55,856 logic elements provide capacity for sizable combinational and sequential designs without external logic.
• Substantial On-chip Memory: Approximately 2.396 Mbits of embedded RAM reduces dependence on external memory for mid-sized buffering and data-path tasks.
• Extensive I/O Count: 374 I/Os enable broad interfacing capability for complex systems and multi-channel designs.
• Compact BGA Package: 780-FBGA (29×29) delivers high pin count in a compact footprint for dense board layouts.
• Low-voltage Core Operation: Core supply specified between 0.970 V and 1.030 V supports integration with modern low-voltage power architectures.
• Commercial Temperature Rating and RoHS Compliance: Listed 0 °C to 85 °C operating range and RoHS compliance align with standard commercial product requirements.

Why Choose EP4CE55F29C8L?

The EP4CE55F29C8L positions itself as a commercial-grade Cyclone IV E FPGA that balances significant logic capacity, embedded memory, and high I/O density in a compact 780-FBGA package. Its documented electrical, switching, and I/O characteristics in the Cyclone IV Device Handbook support predictable integration into commercial electronic systems.

This device is well suited for development teams and OEMs who require programmable logic with substantial on-chip resources, a high number of I/Os, and straightforward board-level integration while operating within standard commercial temperature and voltage ranges.

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