EP4CE55F29C8N

The EP4CE55F29C8N is a Cyclone IV E FPGA manufactured by Intel (Altera). It provides a high-density, programmable logic platform with 55,856 logic elements and approximately 2.4 Mbits of embedded RAM, designed for commercial-grade applications.

With a 374-pin I/O capability, surface-mount 780-FBGA (29×29) package, and a core supply range of 1.15 V to 1.25 V, this device targets designs that require substantial logic capacity, on-chip memory, and dense I/O in a compact package while operating across a 0 °C to 85 °C commercial temperature range.

Key Features

• Cyclone IV E Architecture  High-density FPGA fabric delivering 55,856 logic elements for implementing complex custom logic and state machines.
• On-chip Embedded Memory  Approximately 2.4 Mbits of total RAM bits available for buffering, FIFOs, and memory-intensive functions.
• High I/O Count  374 general-purpose I/O pins for interfacing to peripherals, sensors, and external logic.
• Core Voltage Range  Nominal core supply from 1.15 V to 1.25 V to match system power architectures.
• Package & Mounting  780-FBGA (29×29) supplier package / 780-BGA package case in a surface-mount form factor for compact board integration.
• Commercial Temperature & Compliance  Commercial-grade device rated for 0 °C to 85 °C and RoHS compliant.
• Documented Hardware Reference  Device is covered in the Cyclone IV Device Handbook (Cyclone IV Device Handbook, Volume 3), providing detailed operating and design guidance.

Typical Applications

• Custom digital logic and prototyping  Use the device’s 55,856 logic elements to implement bespoke control logic, state machines, and protocol accelerators.
• Embedded memory-centric designs  Approximately 2.4 Mbits of on-chip RAM supports buffering, packet storage, and intermediate data processing without external memory.
• High-density I/O control  374 I/Os enable direct interfacing to multiple sensors, peripherals, and board-level subsystems for system integration in commercial products.
• Compact system modules  The 780-FBGA (29×29) surface-mount package helps conserve PCB area in space-constrained commercial designs.

Unique Advantages

• Substantial programmable capacity: 55,856 logic elements provide headroom for complex designs and feature-rich implementations.
• Significant on-chip memory: Approximately 2.4 Mbits of embedded RAM reduces reliance on external memory components and simplifies board design.
• Extensive I/O availability: 374 I/Os allow flexible routing and connectivity to diverse peripherals and interfaces.
• Compact BGA packaging: 780-FBGA (29×29) surface-mount package enables dense board layouts and module-level integration.
• Low-voltage core operation: 1.15 V to 1.25 V supply range aligns with modern power domains for efficient system power design.
• Commercial-grade and compliant: Rated for 0 °C to 85 °C and RoHS compliant for commercial product deployments.

Why Choose EP4CE55F29C8N?

The EP4CE55F29C8N combines high logic density, substantial embedded memory, and a large I/O count in a compact 780-FBGA surface-mount package, making it well suited to commercial embedded systems that require programmable logic and on-chip storage. Its specified core voltage range and documented device handbook provide the electrical and design guidance needed for system integration.

This device is aimed at engineering teams building commercial products that need scalable programmable capacity, integrated memory resources, and flexible I/O in a compact footprint—backed by the Cyclone IV documentation for design and validation.

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