EP4CE55F29I7

The EP4CE55F29I7 is an Intel Cyclone IV E FPGA provided in a 780-ball fine-pitch BGA (29×29) package. It delivers a high-density programmable fabric with 55,856 logic elements and approximately 2.4 Mbits of embedded memory targeted at designs that require significant on-chip logic, memory, and I/O connectivity.

With an industrial operating temperature range and a low core-voltage supply window, this device is suited for applications that need robust thermal and electrical margins while maintaining a compact board footprint.

Key Features

• Logic Capacity — 55,856 logic elements to implement complex custom logic, state machines, and control functions on-chip.
• Embedded Memory — Approximately 2.4 Mbits of total on-chip RAM for buffering, FIFOs, and local data storage.
• I/O and Packaging — 374 available I/O pins delivered in a 780-FBGA (29×29) surface-mount package for high connector and peripheral density.
• Electrical Supply — Core voltage supply range of 1.15 V to 1.25 V to match common FPGA core power rails and power-management designs.
• Industrial Temperature — Rated to operate from −40 °C to 100 °C for deployment in industrial environments.
• Mounting and Compliance — Surface-mount package and RoHS compliant for modern assembly processes and regulatory requirements.
• Comprehensive Documentation — The accompanying Cyclone IV device handbook and datasheet include detailed sections on operating conditions, absolute maximum ratings, DC characteristics, power consumption, switching characteristics, and I/O specifications.

Typical Applications

• Industrial Control — Implement motor control logic, sensor aggregation, and deterministic I/O handling where the −40 °C to 100 °C range and high I/O count are required.
• Communications and Networking — Protocol bridging, packet buffering and custom packet-processing functions using the device’s logic capacity and embedded RAM.
• Embedded Systems — On-board programmable logic for system glue, custom accelerators, or peripheral offload in compact, surface-mount designs.
• Test and Measurement — High-density I/O and on-chip memory support instrument control, data capture buffering, and custom signal-processing pipelines.

Unique Advantages

• High logic density: 55,856 logic elements enable implementation of large custom functions without multiple devices.
• Significant on-chip RAM: Approximately 2.4 Mbits of embedded memory supports local buffering and state retention, reducing dependence on external memory in many designs.
• Extensive I/O in a compact package: 374 I/O in a 780-FBGA (29×29) package provides a balance of connectivity and small PCB area.
• Industrial temperature capability: −40 °C to 100 °C rating makes the device suitable for harsh environments and industrial deployments.
• Low-voltage core operation: 1.15 V to 1.25 V supply range aligns with modern power-rail design and efficient power management strategies.
• Regulatory readiness: RoHS compliance supports contemporary environmental and manufacturing requirements.

Why Choose EP4CE55F29I7?

The EP4CE55F29I7 combines substantial logic capacity, embedded memory, and a high I/O count in a compact 780-FBGA package, providing a flexible building block for industrial and embedded applications. Its electrical and thermal specifications support robust operation across a wide temperature range while fitting modern surface-mount assembly flows.

Designers looking to consolidate custom logic, implement on-chip buffering, and maintain a dense I/O layout will find this Cyclone IV E device suitable for mid- to high-complexity programmable logic tasks where proven documentation and device-level specifications are required.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for EP4CE55F29I7. The device’s datasheet and Cyclone IV device handbook contain detailed electrical, timing, and thermal information to support evaluation and integration.