EP4CE55U19I7N

The EP4CE55U19I7N is a Cyclone® IV family FPGA in a 484‑FBGA package designed for industrial applications. It combines a substantial logic capacity with embedded RAM and a high I/O count to support custom digital functions, system glue logic, and mid-density programmable processing.

This device is targeted at designs that require flexible hardware configurability, deterministic I/O, and extended temperature operation, providing a balance of integration and robustness for industrial deployments.

Key Features

• Logic Capacity — 55,856 logic elements for implementing custom digital logic, state machines, and interface bridging.
• Embedded Memory — Approximately 2.4 Mbits of on‑chip RAM to store buffers, FIFOs, and small data structures without external memory.
• I/O Density — 324 user I/O pins to support multiple parallel interfaces, sensor buses, and control signals.
• Package & Mounting — 484‑FBGA (supplier package: 484‑UBGA 19×19) in a surface‑mount form factor for compact PCBs and automated assembly.
• Power Supply — Core supply range of 1.15 V to 1.25 V to match system power rails and power budgeting requirements.
• Industrial Temperature Range — Rated from −40 °C to 100 °C for reliable operation in temperature‑challenging environments.
• RoHS Compliant — Conforms to RoHS requirements for lead‑free assembly and environmental compliance.

Typical Applications

• Industrial Control — Implement motor control logic, sequencing, and deterministic I/O handling using the device’s logic elements and 324 I/Os within industrial temperature limits.
• Protocol Bridging and Interfaces — Create custom protocol converters and parallel/serial interface controllers leveraging the high I/O count and embedded RAM for buffering.
• Embedded System Glue — Offload glue logic, peripheral aggregation, and timing-critical tasks from microcontrollers with available logic and on‑chip memory.
• Prototyping and Custom Logic — Rapidly iterate hardware algorithms and state machines using the Cyclone IV architecture’s programmable resources.

Unique Advantages

• Substantial Logic Resources: 55,856 logic elements provide headroom for complex custom logic and parallel processing structures.
• On‑Chip Memory: Approximately 2.4 Mbits of embedded RAM reduces reliance on external memory, simplifying board layout and lowering BOM count.
• High I/O Count: 324 I/Os enable dense interfacing to sensors, actuators, displays, and peripheral devices without external multiplexing.
• Industrial Grade Temperature Range: −40 °C to 100 °C rating supports deployment in harsh or variable thermal environments.
• Compact, Assembly‑Friendly Package: 484‑FBGA/484‑UBGA (19×19) surface‑mount package supports high‑density PCB designs and automated manufacturing.
• Regulatory Alignment: RoHS compliance supports lead‑free assembly processes and environmental requirements.

Why Choose EP4CE55U19I7N?

The EP4CE55U19I7N positions itself as a versatile mid‑density FPGA option that balances programmable logic, embedded memory, and extensive I/O in a compact FBGA package. Its industrial temperature rating and RoHS compliance make it suitable for long‑life commercial and industrial systems that require on‑board programmability and deterministic hardware behavior.

This part is well suited for engineers and procurement teams designing control systems, custom interface logic, and embedded platforms where on‑chip resources reduce external components and simplify system architecture. The availability of detailed device documentation further supports system integration and verification.

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