EP4CE6E22C6

The EP4CE6E22C6 is a Cyclone® IV E field-programmable gate array (FPGA) offered by Intel. It provides a programmable logic fabric with 6,272 logic elements and on-chip memory to implement custom digital functions in commercial embedded designs.

Packaged in a 144-LQFP exposed pad and specified for surface-mount assembly, this device targets I/O-dense applications that require a balance of logic capacity, embedded RAM, and a compact package footprint.

Key Features

• FPGA Fabric – Cyclone IV E Deliver programmable logic with 6,272 logic elements for implementing custom digital circuits and glue logic.
• Embedded Memory Approximately 0.276 Mbits of embedded memory (276,480 bits) for on-chip buffering, state storage, and small lookup tables.
• I/O Density 91 general-purpose I/O pins to support multiple peripherals, interface signals, and external connections.
• Supply Voltage Core voltage supply range from 1.15 V to 1.25 V to match the Cyclone IV E device requirements.
• Package and Mounting 144-LQFP exposed pad package (supplier device package: 144-EQFP, 20×20) designed for surface-mount assembly and thermal anchoring via the exposed pad.
• Operating Range and Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant to support lead-free assembly processes.
• Documentation Support Backed by Cyclone IV device handbook documentation for device-level electrical characteristics and recommended operating conditions.

Typical Applications

• Embedded Systems — Implement custom control logic, finite-state machines, and feature-specific accelerators in commercial embedded products.
• Prototyping and Development — Rapid hardware prototyping for validating digital designs and interface logic before final ASIC or system integration.
• I/O Expansion and Interface Bridging — Aggregate and adapt multiple peripheral signals or bridge between logic families using the device’s available I/O count.

Unique Advantages

• Balanced Logic Capacity: 6,272 logic elements provide moderate programmable logic resources suitable for a wide range of custom digital tasks without excessive footprint.
• On-Chip Memory Availability: Approximately 0.276 Mbits of embedded RAM enables local buffering and state storage, reducing external memory dependency for small datasets.
• I/O-Rich Package: 91 I/Os in a 144-LQFP exposed pad package give designers flexibility to connect multiple peripherals while maintaining a compact board footprint.
• Surface-Mount, Thermal-Friendly Package: The exposed pad in the 144-LQFP package supports solder-attach thermal conduction and reliable surface-mount assembly.
• Commercial Temperature and RoHS Compliance: Specified 0 °C to 85 °C operation and RoHS compliance align the device with typical commercial manufacturing and deployment practices.
• Documented Implementation Guidance: Supported by Cyclone IV device handbook material for electrical, timing, and operating-condition reference.

Why Choose EP4CE6E22C6?

The EP4CE6E22C6 combines the Cyclone IV E FPGA architecture with a compact 144-LQFP exposed pad package to deliver a practical balance of logic density, on-chip memory, and I/O capacity for commercial embedded designs. Its surface-mount package and RoHS compliance make it suitable for modern assembly processes, while the documented device handbook provides the electrical and operating guidance engineers need for reliable implementation.

This part is well suited to design teams and integration engineers seeking a mid-density FPGA for prototyping, custom logic, and I/O-focused applications where commercial-grade operating range and compact packaging are primary considerations.

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