EP4CE6E22C8

IC FPGA 91 I/O 144EQFP
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 91 276480 6272 144-LQFP Exposed Pad

Quantity 945 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFP Exposed PadNumber of I/O91Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs392Number of Logic Elements/Cells6272
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits276480

Overview of EP4CE6E22C8 – Cyclone IV E FPGA, 6,272 logic elements

The EP4CE6E22C8 is a Cyclone® IV E field-programmable gate array (FPGA) offered in a 144-LQFP exposed-pad package. It delivers mid-range programmable logic capacity with on-chip RAM and flexible I/O in a commercial-temperature, surface-mount form factor.

Designed for applications that require thousands of logic elements, on-chip memory, and up to 91 I/O pins, this device targets developers seeking a compact, RoHS-compliant FPGA solution with a 1.15 V to 1.25 V core supply range.

Key Features

  • Logic Capacity — Contains 6,272 logic elements suitable for mid-range logic integration and custom digital functions.
  • Embedded Memory — Approximately 0.276 Mbits of on-chip RAM (276,480 bits) for buffering, small lookup tables, and state storage.
  • I/O Count — Up to 91 general-purpose I/O pins to support multiple interfaces and peripheral connections.
  • Power Supply — Core voltage supply specified at 1.15 V to 1.25 V to match Cyclone IV E core requirements.
  • Package and Mounting — 144-LQFP exposed-pad package with surface-mount mounting; supplier device package listed as 144-EQFP (20×20).
  • Operating Range — Commercial grade device rated for operation from 0 °C to 85 °C.
  • Compliance — RoHS-compliant for environmental regulation adherence.
  • Documentation — Part of the Cyclone IV device family with supporting device handbook and datasheet information available from the manufacturer.

Typical Applications

  • Embedded control — Implement custom control logic using the device’s 6,272 logic elements and on-chip RAM for state machines and control algorithms.
  • Interface bridging — Use the device’s 91 I/Os to connect and translate between multiple digital peripherals and bus standards.
  • Prototyping and evaluation — Compact LQFP package and surface-mount mounting make the device suitable for board-level prototypes and evaluation designs.
  • Custom logic acceleration — Offload deterministic digital processing tasks to the FPGA fabric using available logic and memory resources.

Unique Advantages

  • Balanced logic and memory — 6,272 logic elements paired with approximately 0.276 Mbits of embedded RAM provide a practical balance for many mid-range FPGA designs.
  • Flexible I/O count — Ninety-one I/Os enable multiple peripheral connections without external multiplexing, simplifying board design.
  • Compact, manufacturable package — 144-LQFP exposed-pad package supports standard surface-mount assembly and thermal management through the exposed pad.
  • Commercial temperature rating — Specified operation from 0 °C to 85 °C aligns with a wide range of consumer and commercial applications.
  • Regulatory readiness — RoHS compliance supports environmental and supply-chain requirements.

Why Choose EP4CE6E22C8?

The EP4CE6E22C8 places Cyclone IV E FPGA capability into a compact, commercial-grade package that balances programmable logic, embedded memory, and I/O resources. Its defined core voltage range and documented Cyclone IV device handbook support engineering integration and power planning.

This part is a practical choice for designers who need a mid-range FPGA for embedded control, interface bridging, or prototype development, offering a combination of logic density, on-chip RAM, and a manufacturable LQFP form factor backed by manufacturer documentation.

If you would like pricing, availability, or to request a formal quote for EP4CE6E22C8, please submit an inquiry and our team will respond with the next steps.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up