EP4CE6E22C7N
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 91 276480 6272 144-LQFP Exposed Pad |
|---|---|
| Quantity | 485 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 91 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 392 | Number of Logic Elements/Cells | 6272 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of EP4CE6E22C7N – Cyclone® IV E FPGA, 6,272 logic elements, 144-LQFP
The EP4CE6E22C7N is an Intel Cyclone IV E field programmable gate array (FPGA) IC offering 6,272 logic elements and approximately 0.276 Mbits of embedded memory. It provides 91 user I/Os in a 144-pin LQFP exposed-pad package suitable for surface-mount assembly.
Designed for commercial-grade applications, the device operates from a 1.15 V to 1.25 V core supply and supports an ambient operating temperature range of 0 °C to 85 °C. The Cyclone IV Device Handbook series provides the supporting technical documentation for the device family.
Key Features
- Core Logic 6,272 logic elements for mid-range configurable logic implementations.
- Embedded Memory Approximately 0.276 Mbits of on-chip RAM to support buffering, state machines, and small data stores.
- Programmable I/O 91 device I/Os to connect peripherals, sensors, and external logic without external glue devices.
- Power Core voltage supply range of 1.15 V to 1.25 V to align with low-voltage FPGA system designs.
- Package & Mounting 144-LQFP exposed pad (supplier package listed as 144-EQFP, 20 × 20 mm) for surface-mount PCB assembly and thermal conduction.
- Commercial Grade Temperature Rated for operation from 0 °C to 85 °C for commercial-environment deployments.
- Environmental Compliance RoHS-compliant to meet common environmental and manufacturing requirements.
Typical Applications
- Commercial Embedded Systems Implement mid-range custom logic, control functions, or protocol handling using the device’s 6,272 logic elements and on-chip RAM.
- Prototyping and Evaluation Evaluate FPGA-based designs and proofs-of-concept where a compact 144-LQFP package and moderate I/O count are appropriate.
- Interface and Glue Logic Consolidate discrete interface logic and bus bridging tasks using the available I/Os and programmable fabric.
- Human-Machine Interfaces Drive UI control, display logic, and peripheral coordination in commercial products with the device’s programmable I/O resources.
Unique Advantages
- Right-sized Logic Capacity: 6,272 logic elements provide a balance of density for mid-range FPGA designs without unnecessary overhead.
- Compact Surface-Mount Package: 144-LQFP exposed-pad package supports compact PCB layouts and thermal management for constrained form factors.
- Moderate I/O Count: 91 I/Os enable direct connections to multiple peripherals and buses, reducing external component count.
- Low-Voltage Core: 1.15 V–1.25 V core voltage aligns with low-power system rails common in commercial FPGA applications.
- Commercial Temperature Rating: Operates across 0 °C to 85 °C for reliable performance in standard commercial environments.
- RoHS Compliant: Meets common environmental manufacturing requirements to simplify regulatory considerations.
Why Choose EP4CE6E22C7N?
The EP4CE6E22C7N positions itself as a pragmatic choice for commercial applications that require mid-range programmable logic, a modest amount of embedded RAM, and a compact surface-mount package. Its combination of 6,272 logic elements, 91 I/Os, and a 144-LQFP exposed-pad package makes it well suited to designs that need configurable logic without large-footprint packaging.
Supported by the Cyclone IV device documentation, this Intel FPGA is appropriate for engineering teams and procurement focused on scalable, documented solutions that integrate into standard commercial product lifecycles.
Request a quote or submit an inquiry for pricing and availability of EP4CE6E22C7N to receive current lead-time and purchasing information.

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