EP4CE6E22C8L

The EP4CE6E22C8L is an Intel Cyclone® IV E Field Programmable Gate Array (FPGA) offered in a 144-LQFP exposed-pad package. The device provides 6,272 logic elements and approximately 0.276 Mbits (276,480 bits) of embedded RAM, delivering mid-density programmable logic and on-chip memory in a compact surface-mount form factor.

Specified for commercial-grade designs, the device features 91 user I/O, a low-voltage core supply range (0.970 V to 1.03 V), and an operating temperature range of 0 °C to 85 °C, making it suitable for a range of commercial embedded applications that require configurable logic, on-chip memory, and a small-footprint package.

Key Features

• Core Logic — 392 logic blocks comprising a total of 6,272 logic elements for mid-density programmable logic implementations.
• On‑Chip Memory — Approximately 0.276 Mbits (276,480 bits) of embedded RAM to support buffering, state machines, and small data stores without external memory.
• I/O — 91 user I/O pins to interface with peripherals, sensors, and external logic in compact systems.
• Power — Core supply voltage range from 0.970 V to 1.03 V to match low-voltage system rails and enable predictable core operation.
• Package & Mounting — 144-LQFP exposed pad (supplier package: 144-EQFP, 20 × 20 mm) in a surface-mount package for board-level thermal and mechanical stability.
• Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• Environmental Compliance — RoHS compliant for lead-free assembly and regulatory alignment in commercial equipment.

Typical Applications

• Commercial Embedded Systems — Mid-density configurable logic and on-chip RAM support control, interfacing, and protocol handling in commercial electronic products.
• Compact Board-Level Designs — The 144-LQFP exposed-pad package and surface-mount mounting simplify PCB integration where board space and thermal performance are considerations.
• Configurable I/O and Glue Logic — 91 I/O pins and programmable logic resources enable interface adaptation and peripheral aggregation in diverse commercial designs.

Unique Advantages

• Balanced Logic and Memory — 6,272 logic elements paired with 276,480 bits of embedded RAM provide a practical balance for mid-range programmable designs without relying on large external memories.
• Compact, Thermally-Conscious Package — The 144-LQFP exposed-pad format offers a small PCB footprint while the exposed pad supports improved thermal dissipation for continuous operation.
• Comprehensive I/O Count — 91 I/O pins deliver flexible connectivity for sensors, interfaces, and peripheral control in single-FPGA solutions.
• Low-Voltage Core — A narrow core voltage window (0.970 V–1.03 V) supports consistent core behavior and integration with contemporary low-voltage power domains.
• Commercial-Grade Specification — Rated 0 °C to 85 °C for standard commercial deployments and RoHS compliance for lead-free assembly workflows.

Why Choose EP4CE6E22C8L?

The EP4CE6E22C8L positions itself as a commercially graded, mid-density FPGA option that combines a practical number of logic elements, embedded memory, and a healthy I/O complement in a compact 144-LQFP exposed-pad package. Its low-voltage core range and RoHS compliance further align the device with contemporary commercial embedded designs that prioritize footprint efficiency and regulatory conformity.

This part is well suited for designers and teams implementing configurable logic and interface consolidation on space-constrained PCBs, offering tangible on-chip resources that reduce the need for additional external components while supporting stable operation across standard commercial temperature ranges.

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