EP4CE6E22C9LN

The EP4CE6E22C9LN is a Cyclone® IV FPGA from Intel, delivering programmable digital logic in a surface-mount 144-LQFP exposed pad package. With 6,272 logic elements, embedded RAM, and a flexible I/O count, it is designed to enable custom digital designs that require moderate logic capacity and on-chip memory within a commercial-temperature-grade device.

Its low core-voltage operating range and industry-standard LQFP package make it suitable for compact board-level implementations where power and package footprint are important considerations.

Key Features

• Logic Capacity  Provides 6,272 logic elements to implement custom digital functions, state machines, and glue logic.
• Embedded Memory  Approximately 0.276 Mbits of on-chip RAM for buffering, lookup tables, and small data stores.
• I/O  91 general-purpose I/O pins to support multiple peripheral interfaces and external signaling requirements.
• Power  Core supply range of 970 mV to 1.03 V to match low-voltage system rails and support predictable power budgeting.
• Package & Mounting  144-LQFP exposed pad package with surface-mount mounting; supplier device package noted as 144-EQFP (20×20).
• Operating Range  Commercial operating temperature from 0 °C to 85 °C for standard embedded and commercial applications.
• Compliance  RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Custom Digital Logic and Prototyping  Implement and iterate custom state machines, control logic, and FPGA-based prototypes using the device’s logic elements and on-chip RAM.
• Interface Bridging and I/O Consolidation  Consolidate multiple parallel or serial interfaces and perform protocol glue logic with access to 91 I/O pins.
• Embedded System Control  Use the FPGA to manage peripherals, timing, and control tasks in compact commercial embedded systems within the specified temperature range.

Unique Advantages

• Right‑sized Logic Count:  6,272 logic elements balance capability and cost for mid-range programmable designs without overprovisioning.
• On‑chip Memory for Local Storage:  Approximately 0.276 Mbits of embedded RAM reduces dependence on external memory for small buffers and look-up tables.
• High I/O Flexibility:  91 I/O pins provide headroom for multiple interfaces and peripheral connections on a single device.
• Compact, Surface‑mount Package:  144-LQFP exposed pad packaging enables board-level integration in space-constrained designs and supports thermal management via the exposed pad.
• Low‑voltage Core Operation:  Core supply between 970 mV and 1.03 V supports integration into low-voltage systems and predictable power planning.
• Commercial Temperature Grade:  Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial and embedded applications.

Why Choose EP4CE6E22C9LN?

The EP4CE6E22C9LN Cyclone IV FPGA combines a practical logic element count, embedded RAM, and a sizable I/O complement in a compact 144-LQFP exposed pad package. It is positioned for designers seeking a commercially graded, RoHS-compliant FPGA that supports mid-range programmable logic tasks while fitting tight board-space and power constraints.

This part is well suited to engineers developing custom control logic, interface bridging, and embedded system functions who need reliable, vendor-backed FPGA silicon with predictable operating voltage and temperature characteristics.

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