EP4CE6E22I7

IC FPGA 91 I/O 144EQFP
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 91 276480 6272 144-LQFP Exposed Pad

Quantity 1,321 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFP Exposed PadNumber of I/O91Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs392Number of Logic Elements/Cells6272
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits276480

Overview of EP4CE6E22I7 – Cyclone® IV E FPGA, 144-LQFP Exposed Pad

The EP4CE6E22I7 is an Intel Cyclone® IV E field-programmable gate array (FPGA) provided in a 144-pin LQFP package with an exposed pad. It delivers mid-range programmable logic capacity and on-chip memory for industrial embedded designs.

Targeted at industrial applications, the device combines 6,272 logic elements and 276,480 bits of embedded RAM with a 91-pin I/O complement, offering a balance of integration and interface density for control, communications, and embedded processing tasks.

Key Features

  • Logic Capacity — 6,272 logic elements and 392 logic blocks provide programmable fabric for custom control, glue logic, and moderate-complexity processing.
  • Embedded Memory — 276,480 bits of on-chip RAM (approximately 0.276 Mbits) for data buffering, FIFOs, and local storage.
  • I/O and Connectivity — 91 user I/O pins support a variety of external interfaces and peripherals in a compact package footprint.
  • Power Supply Range — Core voltage operating range of 1.15 V to 1.25 V to match system power rails and power-management schemes.
  • Package and Mounting — 144-LQFP with exposed pad (supplier device package listed as 144-EQFP, 20×20) in a surface-mount form factor for board-level integration.
  • Industrial Temperature Grade — Rated for operation from −40°C to 100°C to meet industrial environmental requirements.
  • Compliance — RoHS-compliant construction for regulatory and environmental compatibility.

Typical Applications

  • Industrial Control — Implement motor control logic, PLC interfaces, or custom state machines using the device’s logic elements and I/O count.
  • Embedded Processing and Glue Logic — Offload protocol bridging, data formatting, or peripheral control tasks with on-chip RAM for buffering.
  • Communications Gateways — Use available I/O and programmable fabric to adapt and route industrial communication signals between subsystems.
  • Instrumentation and Test — Leverage the device’s logic density and temperature range for measurement front-ends and test instrumentation in industrial environments.

Unique Advantages

  • Balanced Logic and Memory — 6,272 logic elements paired with 276,480 bits of RAM enable mid-range designs that need both processing and local storage.
  • Robust Industrial Operation — −40°C to 100°C operating range and industrial grade classification support deployment in demanding environments.
  • Compact, Serviceable Package — 144-LQFP exposed-pad surface-mount package simplifies thermal management and PCB assembly in space-constrained layouts.
  • Flexible I/O Count — 91 I/O pins provide sufficient interface options for sensors, actuators, and peripheral devices without large-package overhead.
  • Regulatory Compatibility — RoHS compliance supports environmentally conscious product builds and supply-chain requirements.
  • Controlled Core Voltage — Narrow core supply range (1.15 V–1.25 V) enables predictable power planning and regulator selection.

Why Choose EP4CE6E22I7?

The EP4CE6E22I7 positions itself as a practical FPGA choice for engineers who require a mid-range, industrial-grade programmable device with a compact footprint. With 6,272 logic elements, on-chip RAM, and 91 I/O pins in a 144-LQFP exposed-pad package, it suits design teams aiming to integrate moderate logical complexity and interface density while maintaining industrial temperature tolerance.

This part offers a clear specification set for projects that value predictable power requirements, RoHS compliance, and a package form factor compatible with standard surface-mount assembly and thermal considerations.

Request a quote or submit a parts inquiry to obtain pricing, availability, and ordering information for the EP4CE6E22I7.

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