EP4CE6E22I8L

The EP4CE6E22I8L is an Intel Cyclone IV E family FPGA supplied in a 144-LQFP exposed-pad surface-mount package. The device provides 6,272 logic elements and approximately 0.276 Mbits (276,480 bits) of embedded RAM, along with 91 general-purpose I/O pins for mid-density programmable logic implementations.

Designed for industrial environments, the device operates from approximately 0.970 V to 1.03 V core supply and supports an ambient temperature range of −40 °C to 100 °C. Documentation for the Cyclone IV series is published in the Cyclone IV Device Handbook.

Key Features

• Logic Capacity — 6,272 logic elements suitable for mid-density FPGA designs.
• Embedded Memory — Approximately 0.276 Mbits (276,480 bits) of on-chip RAM for buffering and small data structures.
• I/O Integration — 91 I/O pins to connect sensors, actuators, peripherals, and board-level interfaces.
• Core Power — Recommended core supply range from 0.970 V to 1.03 V to match system power rails and design margins.
• Package and Mounting — 144-LQFP exposed-pad package (supplier package listed as 144-EQFP 20×20) in a surface-mount form factor for compact board integration and thermal management via the exposed pad.
• Industrial Grade Operation — Rated operating temperature range of −40 °C to 100 °C for deployment in industrial applications.
• Regulatory Status — RoHS compliant.
• Documented Family — Part of the Cyclone IV device family; supported by the Cyclone IV Device Handbook covering operating conditions, DC characteristics, switching characteristics, and system-level guidance.

Typical Applications

• Industrial Control — Use the device where industrial temperature ranges and 91 I/O channels are required for sensor and actuator interfacing and real-time control logic.
• Embedded Logic and Glue — Implement protocol bridging, bus interfacing, and custom control functions leveraging 6,272 logic elements and on-chip RAM.
• Instrumentation and Test — Deploy in measurement and test equipment that requires a compact, surface-mount FPGA with exposed-pad thermal options and industrial temperature tolerance.

Unique Advantages

• Mid-density programmable capacity: 6,272 logic elements provide a balance between integration and cost for many embedded and industrial designs.
• Integrated memory resources: Approximately 0.276 Mbits of embedded RAM reduces external memory requirements for small buffering and state storage.
• Robust I/O count: 91 I/O pins enable diverse peripheral connectivity without immediate need for expanders.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in harsh or temperature-variable environments.
• Compact, thermally aware package: 144-LQFP with exposed pad supports surface-mount assembly and improved board-level thermal performance.
• RoHS compliant: Meets environmental compliance requirements for many production programs.

Why Choose EP4CE6E22I8L?

The EP4CE6E22I8L delivers a practical mix of logic density, embedded memory, and I/O capability in a compact 144-LQFP exposed-pad package tailored for industrial applications. Its documented placement within the Cyclone IV family provides design teams with access to detailed device handbook material for electrical characteristics and recommended operating conditions.

This device is suited to engineers and procurement teams targeting mid-density programmable logic tasks—such as protocol bridging, control logic, and instrument front-ends—where industrial temperature range, RoHS compliance, and a compact surface-mount package are required.

Request a quote or submit an inquiry to get pricing and lead-time information for the EP4CE6E22I8L.