EP4CE6F17C6

The EP4CE6F17C6 is a Cyclone IV E family Field Programmable Gate Array (FPGA) IC providing 6,272 logic elements and approximately 276,480 bits of embedded RAM. It delivers a balanced combination of programmable logic capacity, on-chip memory, and a 179-pin I/O complement in a compact 256-LBGA package for commercial-grade electronic designs.

Designed for general programmable-logic applications, this device is characterized by its 1.15 V to 1.25 V core supply requirement, surface-mount 256-FBGA (17×17) package format, RoHS compliance and a commercial operating range of 0 °C to 85 °C. Detailed device specifications are provided in the Cyclone IV Device Handbook.

Key Features

• Core Capacity  Provides 6,272 logic elements organized across 392 LABs/CLBs, suitable for small-to-medium FPGA logic implementations.
• Embedded Memory  Approximately 276,480 bits of on-chip RAM for datapath buffering, small look-up tables and temporary storage.
• I/O Density  179 user I/O pins to support multiple peripheral connections and interface routing directly from the device.
• Power  Core supply voltage range of 1.15 V to 1.25 V for the device core.
• Package and Mounting  256-LBGA package supplied as 256-FBGA (17×17) in a surface-mount form factor for compact board integration.
• Operating Conditions  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance and Documentation  RoHS-compliant; full device-level specifications and operating conditions are documented in the Cyclone IV Device Handbook.

Typical Applications

• Custom Logic and Prototyping  Leverage 6,272 logic elements to implement custom digital functions and iterate hardware designs.
• On-chip Memory Dependent Functions  Use approximately 0.276 Mbits of embedded RAM for buffering, small FIFOs and lookup tables within control and data paths.
• Peripheral and Sensor Interfaces  179 I/O pins allow direct interfacing to a variety of external peripherals, sensors and control signals.
• Compact Board-level Integration  Surface-mount 256-FBGA (17×17) packaging supports space-constrained PCB layouts while maintaining high I/O density.

Unique Advantages

• Balanced Logic and Memory  Combines 6,272 logic elements with integrated RAM for mixed logic-plus-buffering implementations without external memory for small datasets.
• High I/O Count in a Small Package  179 I/O pins in a 256-LBGA (17×17) format minimize board area while preserving connectivity options.
• Low-voltage Core  1.15 V to 1.25 V supply requirement aligns with low-voltage system designs and modern power rails.
• Commercial Temperature Rating  Specified for 0 °C to 85 °C operation to match mainstream commercial electronic applications.
• Standards and Documentation  RoHS compliance and comprehensive device documentation in the Cyclone IV Device Handbook support regulatory and development needs.

Why Choose EP4CE6F17C6?

The EP4CE6F17C6 offers a practical balance of logic capacity, embedded memory and I/O density in a compact surface-mount LBGA package, making it a straightforward choice for designers implementing small-to-medium sized programmable logic and interfacing tasks. Its documented operating conditions, commercial temperature range and RoHS compliance provide predictable integration into mainstream electronic systems.

This device suits engineering teams and procurement for projects that require a documented Cyclone IV E FPGA with defined logic, RAM and I/O resources, and benefits from the published Cyclone IV Device Handbook for device-level specifications and design guidance.

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