EP4CE6F17C7
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 179 276480 6272 256-LBGA |
|---|---|
| Quantity | 627 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 179 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 392 | Number of Logic Elements/Cells | 6272 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of EP4CE6F17C7 – Cyclone® IV E FPGA, 6272 logic elements, 276480-bit RAM, 256-LBGA
The EP4CE6F17C7 is a Cyclone® IV E field-programmable gate array (FPGA) offered as a surface-mount IC in a 256-LBGA package. The device provides 6,272 logic elements, approximately 0.28 Mbits of embedded memory (276,480 bits), and 179 user I/O pins, making it suitable for compact programmable logic and embedded control tasks.
Designed for commercial-grade applications, the device operates from a core voltage supply of 1.15 V to 1.25 V and across a 0 °C to 85 °C operating range. The device is RoHS compliant and is supplied in a 256-pin FBGA form factor (17×17 mm supplier package footprint).
Key Features
- Core Logic 6,272 logic elements provide the programmable fabric for implementing custom digital functions and state machines.
- Embedded Memory Approximately 0.28 Mbits of on-chip RAM (276,480 bits) for buffering, FIFOs, and small data storage directly on-chip.
- I/O Count 179 user I/O pins support a wide range of external interfaces and peripheral connections in a single device.
- Package and Mounting 256-LBGA package with surface-mount mounting; supplier device package listed as 256-FBGA (17×17).
- Power Core supply voltage range of 1.15 V to 1.25 V for compatibility with standard low-voltage FPGA power rails.
- Operating Conditions Commercial-grade device rated for operation from 0 °C to 85 °C; datasheet includes detailed operating conditions, DC characteristics, and switching specifications.
- Regulatory Compliance RoHS compliant for environmental conformity in commercial electronic assemblies.
Typical Applications
- Embedded Control Implement custom control logic, finite state machines, and peripheral interfaces using the device's logic elements and on-chip RAM.
- Prototyping and Development Hardware prototypes and iterative designs benefit from the reprogrammable fabric and abundant I/O in a compact BGA package.
- Interface Bridging Use the programmable I/O and logic resources to bridge between digital peripherals, perform protocol adaption, or implement glue logic.
Unique Advantages
- Right-sized Logic Capacity: 6,272 logic elements provide a balance of resources for mid-range FPGA designs without excess cost or board space.
- Integrated On-chip Memory: Approximately 0.28 Mbits of embedded RAM reduces dependency on external memory for small buffers and FIFOs.
- High I/O Count in a Compact Package: 179 I/O pins in a 256-LBGA/256-FBGA (17×17) footprint enable dense connectivity while preserving PCB real estate.
- Low-voltage Core Support: A defined 1.15 V–1.25 V supply window aligns with modern low-voltage power rails for efficient board-level power design.
- Commercial-grade and RoHS Compliant: Rated for 0 °C–85 °C operation and RoHS compliant for standard commercial product deployments.
Why Choose EP4CE6F17C7?
The EP4CE6F17C7 Cyclone IV E FPGA is positioned for designers who need a compact, reprogrammable logic device with a practical mix of logic elements, embedded memory, and I/O capability. Its 256-pin BGA package, low-voltage core, and commercial temperature rating make it suitable for a wide range of embedded and interface-centric designs.
This device delivers predictable, documentable specifications—including core supply range, on-chip memory, I/O count, and operating temperature—that support repeatable designs and straightforward BOM planning for commercial applications.
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