EP4CE6F17C6N

IC FPGA 179 I/O 256FBGA
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 179 276480 6272 256-LBGA

Quantity 291 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O179Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs392Number of Logic Elements/Cells6272
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits276480

Overview of EP4CE6F17C6N – Cyclone IV E FPGA, 6272 logic elements, 256‑LBGA

The EP4CE6F17C6N is a Cyclone® IV E field programmable gate array (FPGA) IC from Intel. It integrates 6,272 logic elements with embedded RAM and supports 179 I/O pins in a 256‑lead BGA package.

Designed for commercial‑grade applications, this surface‑mount FPGA operates across a 1.15 V to 1.25 V core supply window and a 0 °C to 85 °C operating temperature range, and is RoHS compliant.

Key Features

  • Logic Capacity — 6,272 logic elements provide flexible programmable logic resources for custom digital functions.
  • Embedded Memory — Approximately 0.276 Mbits of on‑chip RAM (276,480 total RAM bits) for FIFOs, buffers, and small data storage.
  • I/O Density — 179 user I/O pins to interface with external peripherals, sensors, and buses.
  • Power — Core supply voltage defined at 1.15 V to 1.25 V for compatibility with low‑voltage system domains.
  • Package and Mounting — 256‑lead LBGA package; supplier device package listed as 256‑FBGA (17×17). Surface mountable construction for standard PCB assembly.
  • Operating Range — Commercial operating temperature range of 0 °C to 85 °C, matching the part's commercial grade classification.
  • Compliance — RoHS compliant material and processing.
  • Documentation — Supported by Cyclone IV device documentation covering operating conditions, DC characteristics, switching characteristics, I/O standards, and power consumption.

Typical Applications

  • Commercial Embedded Systems — Programmable logic integration where a compact FPGA with moderate logic and RAM resources is required.
  • Interface and Glue Logic — Use as a configurable bridge for custom I/O aggregation and protocol adaptation using available I/O pins and logic elements.
  • Prototyping and System Development — Provides reconfigurable logic and on‑chip RAM for early development and hardware validation in commercial environments.

Unique Advantages

  • Balanced Logic and Memory — 6,272 logic elements combined with approximately 0.276 Mbits of embedded RAM offers a pragmatic balance for mid‑range programmable designs.
  • High I/O Count in Compact Package — 179 I/Os in a 256‑lead BGA footprint supports dense interfacing while keeping board area compact.
  • Low‑Voltage Core Operation — Narrow core supply range (1.15 V–1.25 V) simplifies power‑rail planning for low‑voltage systems.
  • Commercial Temperature Rating — Rated 0 °C to 85 °C to meet the needs of mainstream commercial product environments.
  • RoHS Compliant — Conforms to RoHS requirements for environmental and regulatory compatibility.
  • Standard Surface‑Mount Packaging — 256‑lead BGA/FBGA format supports standard assembly and high‑density PCB designs.

Why Choose EP4CE6F17C6N?

The EP4CE6F17C6N positions itself as a practical Cyclone IV E FPGA choice for commercial designs that require a moderate number of logic elements, a modest amount of on‑chip RAM, and a substantial I/O count in a compact surface‑mount package. Its defined core voltage range and commercial temperature rating make it suitable for mainstream electronic products and development platforms.

Engineers specifying this device benefit from a documented Cyclone IV device handbook and device datasheet coverage that includes operating conditions, DC and switching characteristics, I/O standards, and power considerations—providing the technical detail necessary for integration and system design.

Request a quote or submit an inquiry to receive pricing, availability, and lead‑time information for EP4CE6F17C6N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up