EP4CE6F17C7N
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 179 276480 6272 256-LBGA |
|---|---|
| Quantity | 1,526 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 179 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 392 | Number of Logic Elements/Cells | 6272 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of EP4CE6F17C7N – Cyclone® IV E Field Programmable Gate Array (FPGA) IC 179 276480 6272 256-LBGA
The EP4CE6F17C7N is a Cyclone IV E field programmable gate array (FPGA) offering 6,272 logic elements and approximately 276,480 bits of on-chip RAM. It delivers a mid-range programmable logic solution in a compact 256-LBGA package for commercial-temperature embedded designs.
With 179 I/O pins, a surface-mount 256-FBGA (17×17 mm) supplier package, and a 1.15–1.25 V core supply range, this device is suited to applications that require reprogrammable digital logic, moderate embedded memory, and a dense I/O footprint within a commercial operating range (0 °C to 85 °C). The device is RoHS compliant and documented in the Cyclone IV device handbook and datasheet.
Key Features
- Core / Logic 6,272 logic elements for implementing custom digital functions and combinational/sequential logic.
- Embedded Memory Approximately 0.276 Mbits of on-chip RAM (276,480 total bits) for buffering, state storage, and small tables.
- I/O Density 179 I/O pins to support multiple interfaces and signal consolidation on a single device.
- Power Supply Core voltage requirement of 1.15 V to 1.25 V for low-voltage system integration.
- Package & Mounting 256-LBGA package; supplier device package listed as 256-FBGA (17×17 mm). Surface-mount mounting type.
- Operating Range & Grade Commercial grade operation from 0 °C to 85 °C.
- Compliance & Documentation RoHS compliant; device is part of the Cyclone IV family with supporting device handbook and datasheet documentation.
Typical Applications
- Prototyping and Development Reconfigurable logic for proof-of-concept designs and FPGA-based hardware validation using 6,272 logic elements and flexible I/O.
- Interface Bridge and Protocol Conversion Consolidate multiple peripheral interfaces through the device's 179 I/O pins and on-chip logic resources.
- Custom Control and Glue Logic Implement board-level control, state machines, and specialized glue logic without adding multiple discrete components.
- Embedded System Integration On-chip RAM and programmable logic enable compact integration of control and buffering functions in commercial-temperature products.
Unique Advantages
- Mid-range programmable density: 6,272 logic elements provide ample resources for moderate-complexity designs while keeping board-level complexity low.
- On-chip RAM: Approximately 0.276 Mbits of embedded memory reduces dependence on external RAM for small buffers and lookup tables.
- High I/O count: 179 I/O pins simplify interface consolidation and reduce the need for additional interface chips.
- Compact BGA footprint: 256-LBGA / 256-FBGA (17×17 mm) packaging supports space-constrained assemblies and surface-mount manufacturing.
- Low-voltage core: 1.15–1.25 V supply range aligns with modern low-voltage system domains.
- Commercial-grade and compliant: 0 °C to 85 °C operating range and RoHS compliance suit a wide range of commercial electronic products.
Why Choose EP4CE6F17C7N?
The EP4CE6F17C7N provides a balanced combination of programmable logic capacity, embedded memory, and a high I/O count in a compact surface-mount BGA package. Its 6,272 logic elements and approximately 0.276 Mbits of on-chip RAM make it appropriate for designers and OEMs who need mid-range FPGA resources within commercial-temperature products.
As part of the Cyclone IV E family, this device is supported by Cyclone IV documentation and a datasheet, enabling informed integration into systems that require reprogrammable logic, interface consolidation, and compact board-level footprint.
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