EP4CE6F17C8LN
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 179 276480 6272 256-LBGA |
|---|---|
| Quantity | 534 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 179 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 392 | Number of Logic Elements/Cells | 6272 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of EP4CE6F17C8LN – Cyclone® IV E Field Programmable Gate Array (FPGA), 6,272 Logic Elements, 179 I/Os
The EP4CE6F17C8LN is an Intel Cyclone® IV E field programmable gate array (FPGA) supplied in a 256-ball BGA package. It provides 6,272 logic elements and approximately 0.276 Mbits of on-chip RAM, making it suitable for commercial embedded designs that require field-configurable digital logic and moderate embedded memory.
With 179 user I/Os, a compact 256-LBGA (supplier package: 256-FBGA, 17×17) footprint, and documented electrical and timing characteristics in the Cyclone IV device handbook, this device targets commercial applications where integration, flexibility, and RoHS compliance are required.
Key Features
- Core Architecture Cyclone IV E FPGA architecture delivered in the EP4CE6F17C8LN device, offering 6,272 logic elements for custom digital implementations.
- Embedded Memory Approximately 0.276 Mbits of on-chip RAM to implement FIFOs, small buffers, or memory-mapped logic.
- I/O Capacity 179 general-purpose I/O pins to interface with external peripherals, sensors, and logic domains.
- Package and Mounting 256-LBGA package (supplier: 256-FBGA, 17×17) designed for surface-mount assembly in space-constrained boards.
- Power and Operating Conditions Core supply operating range 970 mV to 1.03 V with an operating temperature range of 0 °C to 85 °C (commercial grade).
- Environmental Compliance RoHS-compliant construction to meet common environmental and regulatory procurement requirements.
- Documentation Device handbook and datasheet detail operating conditions, DC characteristics, switching characteristics, I/O specifications, and power management guidance for system integration.
Typical Applications
- Commercial Embedded Systems — Provide customizable logic, glue logic, and protocol adaptation in consumer and commercial products.
- Prototyping and Development — Implement custom logic functions and iterate designs quickly during board bring-up and proof-of-concept phases.
- Communications Peripherals — Implement parallel interfaces, bus bridging, or control logic where moderate logic density and many I/Os are required.
- Custom Control and Interface Modules — Replace fixed-function ASICs with reprogrammable logic for evolving product requirements in commercial applications.
Unique Advantages
- Balanced Logic Capacity: 6,272 logic elements provide sufficient gate count for mid-range custom digital functions without excessive PCB footprint.
- Ample I/O: 179 I/Os enable direct connection to multiple external devices and interfaces, reducing the need for additional I/O expanders.
- Compact Package: 256-LBGA (256-FBGA, 17×17) offers a high-pin-count solution in a compact form factor for dense board designs.
- Commercial Temperature Range: Rated for 0 °C to 85 °C to match typical commercial product deployment environments.
- Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and procurement requirements.
Why Choose EP4CE6F17C8LN?
The EP4CE6F17C8LN positions itself as a practical Cyclone IV E FPGA for commercial products that require a mid-range logic resource, significant I/O availability, and on-chip RAM for buffering and local storage. Its 256-ball BGA package and surface-mount design make it suitable for compact, production-oriented boards where reprogrammability and integration are priorities.
Engineers and procurement teams will find the device appealing for designs that need field-programmable flexibility, documented electrical and timing data, and RoHS compliance. The device handbook provides the electrical, timing, and configuration details necessary for system-level integration and long-term design support.
If you would like pricing, availability, or to submit a request for a quote for EP4CE6F17C8LN, please request a quote or submit an inquiry through your preferred procurement channel.

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