EP4CE6F17C9LN

The EP4CE6F17C9LN is a Cyclone® IV E Field Programmable Gate Array (FPGA) IC in a 256‑lead BGA package designed for commercial applications. It provides a mid‑density programmable fabric with 6,272 logic elements, embedded on‑chip RAM, and 179 user I/O to implement custom digital functions and interface logic.

Engineered for applications that require a balance of integration and low‑voltage core operation, the device is supplied for surface‑mount assembly and is RoHS compliant. Detailed device operating conditions and electrical characteristics are available in the Cyclone IV device documentation.

Key Features

• Core Logic — 6,272 logic elements and 392 logic array blocks provide programmable fabric for custom digital designs.
• Embedded Memory — Approximately 0.276 Mbits of on‑chip RAM (276,480 total RAM bits) for FIFO, buffering and local storage needs.
• Flexible I/O — 179 user I/O pins support a variety of external interfacing and signal routing within a single device.
• Power — Core voltage supply range of 0.97 V to 1.03 V for integration into low‑voltage power architectures.
• Package & Mounting — 256‑lead LBGA package, surface‑mount; supplier device package also listed as 256‑FBGA (17×17) for layout planning.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for commercial‑temperature applications.
• Regulatory Status — RoHS compliant, supporting lead‑free assembly processes.
• Documentation Coverage — Device handbook and datasheet content include operating conditions, DC characteristics, switching characteristics, supply current, ESD performance, and other detailed specifications for design verification.

Typical Applications

• Custom digital logic and glue circuitry — Implement control, glue logic and protocol bridging using 6,272 logic elements and 179 I/O pins.
• Embedded buffering and data handling — On‑chip RAM (276,480 bits) supports FIFOs, small buffers and local data storage for streaming or burst transfers.
• Interface consolidation — Combine multiple external signals and peripherals into a single programmable device in a compact 256‑lead BGA package.

Unique Advantages

• Well‑balanced density: 6,272 logic elements and 392 logic array blocks offer ample capacity for medium‑complexity designs without unnecessary overhead.
• Integrated memory: Approximately 0.276 Mbits of embedded RAM reduces external memory needs for many control and buffering tasks, simplifying BOM and board layout.
• High I/O count: 179 user I/O pins enable flexible external connectivity and system integration from a single device.
• Compact packaging: 256‑lead LBGA (supplier package noted as 256‑FBGA 17×17) supports dense PCB layouts while remaining suitable for surface‑mount assembly.
• Low‑voltage core compatibility: Core supply range of 0.97–1.03 V aligns with modern low‑voltage power domains to ease power‑supply design.
• Regulatory and documentation support: RoHS compliance and comprehensive device handbook coverage aid manufacturing and qualification activities.

Why Choose EP4CE6F17C9LN?

The EP4CE6F17C9LN delivers a balanced combination of programmable logic, embedded memory, and a high I/O count in a compact 256‑lead BGA package, making it well suited for commercial‑grade designs that require moderate logic capacity and flexible interfacing. Its documented operating characteristics and device handbook coverage support engineering evaluation and integration into production designs.

Designers seeking a mid‑density Cyclone IV E FPGA for control logic, protocol bridging, or moderate buffering tasks will find the EP4CE6F17C9LN provides clear, verifiable specifications for voltage supply, temperature range, package, and I/O resources to support reliable system integration.

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