EP4CE6F17I8LN

The EP4CE6F17I8LN is a Cyclone® IV E family FPGA from Intel, providing a compact, industrial‑grade programmable logic solution. It integrates 6,272 logic elements and approximately 0.276 Mbits (276,480 bits) of on‑chip RAM to support mid‑range control, interfacing and custom logic tasks.

With 179 user I/Os, a low-voltage core supply range (0.97–1.03 V), a 256‑ball package footprint and an extended operating range of −40 °C to 100 °C, this device is suited to designs that demand moderate logic density, numerous I/O and robust temperature performance.

Key Features

• Core Logic  6,272 logic elements for implementing custom state machines, control logic and glue logic in a mid‑density FPGA fabric.
• Embedded Memory  Approximately 0.276 Mbits (276,480 bits) of on‑chip RAM for buffering, FIFOs and local data storage.
• I/O Capacity  179 I/O pins to connect sensors, actuators, peripherals and external logic with flexible pin count for mixed I/O requirements.
• Power Supply  Core voltage range from 970 mV to 1.03 V enabling low‑voltage operation consistent with Cyclone IV E core requirements.
• Package & Mounting  256‑LBGA package (supplier device package listed as 256‑FBGA, 17×17) in a surface‑mount form factor to support compact PCB layouts.
• Industrial Temperature Grade  Rated for −40 °C to 100 °C operating temperature, suitable for industrial environments.
• RoHS Compliance  Device is RoHS compliant.

Typical Applications

• Industrial Control  Use the FPGA's logic elements and abundant I/Os for machine control, protocol bridging and custom automation interfaces within industrial temperature ranges.
• Embedded Processing Glue Logic  Implement custom peripherals, bus adaptation and timing control between processors and external devices using on‑chip RAM and programmable logic.
• Interface and Protocol Conversion  Leverage 179 I/Os to translate and aggregate signals between legacy peripherals, sensors and modern controllers in compact board designs.
• Prototyping and Custom IP  Deploy mid‑density logic and embedded memory for proof‑of‑concepts and custom IP development that require surface‑mount, BGA packaging.

Unique Advantages

• Balanced Logic Density: 6,272 logic elements provide a practical balance between capacity and cost for mid‑complexity designs.
• Sufficient Embedded Memory: Approximately 0.276 Mbits of on‑chip RAM supports local buffering and small data structures without external memory.
• High I/O Count: 179 I/Os reduce the need for external multiplexing or expanders in multi‑signal systems.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to address applications requiring extended environmental tolerance.
• Compact BGA Package: 256‑ball BGA packaging (17×17 supplier footprint) enables compact PCBs while preserving signal density.
• Regulatory Compliance: RoHS compliance simplifies integration into environmentally regulated product lines.

Why Choose EP4CE6F17I8LN?

The EP4CE6F17I8LN positions itself as a practical mid‑density Cyclone IV E FPGA option for engineers who need a blend of programmable logic, on‑chip RAM and a high I/O count in a compact, industrial‑grade package. Its low core voltage range and surface‑mount BGA footprint make it suitable for space‑conscious board designs that demand reliable operation across a wide temperature span.

This device is well suited for teams building industrial control systems, interface bridges or custom embedded logic where verified vendor support, predictable resource counts and RoHS compliance are important factors in procurement and long‑term deployment.

Request a quote or submit an inquiry to check availability, pricing and lead times for the EP4CE6F17I8LN.