EP4CE75F23C6

The EP4CE75F23C6 is an Intel Cyclone® IV E field programmable gate array (FPGA) in a 484-ball BGA package. It provides a balance of programmable logic, embedded memory, and a large I/O count for commercial applications.

With 75,408 logic elements, approximately 2.81 Mbits of on-chip RAM and up to 292 I/O pins, this device targets designs that require substantial logic capacity and flexible interfacing in a surface-mount 484-FBGA (23×23) package.

Key Features

• Programmable Logic  75,408 logic elements to implement complex digital functions and custom logic blocks.
• Embedded Memory  Approximately 2.81 Mbits of on-chip RAM to support buffering, state storage, and algorithm implementation.
• I/O Capacity  Up to 292 I/O pins for broad connectivity and flexible peripheral interfacing.
• Power Supply  Operates from a core voltage supply range of 1.15 V to 1.25 V.
• Package and Mounting  484-BGA (484-FBGA, 23×23) package designed for surface-mount PCB assembly.
• Operating Range  Commercial grade operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Custom digital processing  Implement signal processing or algorithmic acceleration using 75,408 logic elements and embedded RAM.
• High‑pin-count I/O control  Drive multiple peripherals and interfaces with up to 292 I/O pins for dense connectivity requirements.
• Embedded system integration  Integrate programmable logic into compact surface-mount designs using the 484-FBGA package.
• Prototyping and evaluation  Validate complex logic designs that require substantial logic capacity and on-chip memory.

Unique Advantages

• High logic capacity: 75,408 logic elements enable complex custom logic implementations without external gate arrays.
• Significant on-chip memory: Approximately 2.81 Mbits of RAM reduces dependence on external memory for many buffering and state needs.
• Large I/O complement: 292 I/O pins provide flexibility for multi‑interface designs and parallel data paths.
• Compact BGA footprint: 484-FBGA (23×23) package supports high-density PCB layouts and surface-mount assembly.
• Commercial temperature range: Rated for 0 °C to 85 °C to match common commercial product environments.
• Regulatory compliance: RoHS compliant for environmentally conscious designs.

Why Choose EP4CE75F23C6?

The EP4CE75F23C6 combines a substantial logic element count, meaningful embedded memory, and a high I/O count in a compact 484-BGA surface-mount package, making it suitable for commercial designs that require on-board programmable logic and dense connectivity. Its specified core voltage range and commercial temperature rating provide predictable electrical and environmental parameters for system integration.

This device is appropriate for designers and engineering teams building mid-to-high complexity digital systems who need integrated logic capacity, on-chip RAM, and broad I/O in a BGA form factor, backed by Intel's Cyclone® IV E family lineage.

Request a quote or submit a parts inquiry to obtain pricing and availability for EP4CE75F23C6.