EP4CE6F17I8L

The EP4CE6F17I8L is a Cyclone® IV E field programmable gate array (FPGA) from Intel (Altera). It provides a compact, programmable logic solution with defined on-chip memory, I/O count, and a ball-grid array package suitable for surface-mount assembly.

Built for designs that require a balance of logic capacity, embedded memory and a high pin-count package, this device is specified for industrial-grade operation and includes a detailed device handbook covering operating conditions and electrical characteristics.

Key Features

• Logic Capacity — 6,272 logic elements to implement combinational and sequential logic functions.
• Embedded Memory — Approximately 0.276 Mbits of total on-chip RAM (276,480 bits) for buffering, state storage and small data structures.
• I/O Resources — 179 user I/O pins to interface with peripherals, sensors, and external logic devices.
• Power Supply Range — Core voltage specified from 0.97 V to 1.03 V, enabling defined power sequencing and supply design.
• Package — 256-LBGA primary package; supplier package listed as 256-FBGA (17×17) for surface-mount PCB integration.
• Temperature and Grade — Industrial operating temperature range from −40 °C to 100 °C for use in temperature-challenging environments.
• Compliance — RoHS compliant.
• Documentation — Supported by the Cyclone IV device handbook and detailed datasheet sections covering operating conditions, DC characteristics, switching characteristics, and more.

Unique Advantages

• Right-sized logic and memory: 6,272 logic elements and approximately 0.276 Mbits of embedded RAM provide a compact programmable fabric for control, glue logic, and medium-complexity functions without excessive board-level components.
• High I/O density: 179 I/O pins allow broad external connectivity while maintaining a single-package solution, simplifying PCB routing for multi-signal designs.
• Industry-grade thermal range: Specified −40 °C to 100 °C operation supports deployment in industrial environments where extended temperature capability is required.
• Defined core supply window: The 0.97 V–1.03 V core voltage specification enables precise power-supply design and predictable device behavior.
• Surface-mount BGA package: 256-ball LBGA/FBGA packaging (17×17) offers a compact footprint and robust soldered connection for production-friendly assembly.
• Standards-compliant supply chain readiness: RoHS compliance supports regulatory and manufacturing requirements for lead-free production.

Why Choose EP4CE6F17I8L?

The EP4CE6F17I8L combines a defined set of logic elements, embedded RAM, and a high I/O count in a compact 256-ball BGA package, offering a practical, programmable building block for embedded and industrial designs. Its industrial temperature rating and documented electrical and switching characteristics make it suitable for projects where predictable behavior across temperature and a clearly specified power envelope are important.

Engineers and procurement teams will find the device appealing for designs that require moderate logic capacity, local memory, and significant I/O in a single, manufacturable surface-mount package, supported by comprehensive datasheet material from the Cyclone IV family.

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