EP4CE6F17I7
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 179 276480 6272 256-LBGA |
|---|---|
| Quantity | 656 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 179 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 392 | Number of Logic Elements/Cells | 6272 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of EP4CE6F17I7 – Cyclone® IV E FPGA, 6,272 logic elements, 179 I/O, 256-LBGA
The EP4CE6F17I7 is an Intel Cyclone IV E field programmable gate array (FPGA) supplied in a 256-pin L-BGA package. It provides 6,272 logic elements and approximately 0.276 Mbits (276,480 bits) of embedded RAM, delivered in a surface-mount 256-FBGA (17×17) footprint.
Designed for industrial-grade applications, the device supports wide operating conditions (1.15–1.25 V core supply and −40 °C to 100 °C ambient range) and a robust I/O count (179 pins), making it suitable for industrial embedded systems and I/O-dense programmable logic roles.
Key Features
- Core Logic 6,272 logic elements provide the programmable fabric for custom digital functions and glue logic.
- Embedded Memory Approximately 0.276 Mbits of on-chip RAM (276,480 bits) for buffering, FIFOs, and small-state storage.
- I/O Density 179 I/O pins to support multiple interfaces, sensor connections, and peripheral control in compact designs.
- Power Supply Core voltage supply range from 1.15 V to 1.25 V for compatibility with Cyclone IV E power domains.
- Package & Mounting 256-pin L-BGA package (supplier package: 256-FBGA, 17×17) optimized for surface-mount assembly.
- Industrial Temperature Range Rated for −40 °C to 100 °C operation to meet industrial-environment requirements.
- Regulatory Compliance RoHS compliant for environmental and manufacturing conformity.
- Documentation Support Detailed device documentation is available in the Cyclone IV Device Handbook covering operating conditions, DC characteristics, power consumption, switching characteristics and more.
Typical Applications
- Industrial Control Programmable logic for machine control tasks, sequence management, and interface bridging in industrial environments.
- I/O-Intensive Interfaces Sensor aggregation, protocol translation, and peripheral interfacing where a high pin count and flexible I/O are required.
- Embedded System Glue Logic Custom bus bridging, timing control, and synchronous logic integration between processors and peripherals.
- Data Buffering and Small Memory Tasks On-chip RAM supports buffering, small FIFO implementations, and temporary data storage within constrained designs.
Unique Advantages
- Compact, programmable logic capacity: 6,272 logic elements enable integration of custom digital functions without external ASICs.
- On-chip memory for localized buffering: Approximately 0.276 Mbits of embedded RAM reduces reliance on external memory for small data-storage needs.
- High I/O count in a small package: 179 I/O pins in a 256-FBGA (17×17) package provide dense interfacing while minimizing PCB area.
- Industrial operating range: Rated for −40 °C to 100 °C to support deployments in demanding ambient conditions.
- Controlled power domain: Defined core supply range (1.15–1.25 V) simplifies power design and regulation for the FPGA core.
- RoHS compliant: Meets environmental manufacturing requirements for lead-free assembly.
Why Choose EP4CE6F17I7?
The EP4CE6F17I7 positions itself as a practical, industrial-grade Cyclone IV E FPGA option for engineers needing a balance of programmable logic, embedded RAM, and substantial I/O in a compact BGA package. Its specified operating voltage, RoHS compliance, and documented device handbook make it a verifiable choice for embedded and control designs that require predictable electrical and thermal behavior.
This device is well suited to teams integrating custom digital functions, implementing protocol bridging, or consolidating multiple discrete components into a single programmable device—delivering scalability and maintainability within industrial hardware platforms.
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