EP4CE6F17C9L
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 179 276480 6272 256-LBGA |
|---|---|
| Quantity | 139 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 179 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 392 | Number of Logic Elements/Cells | 6272 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of EP4CE6F17C9L – Cyclone® IV E Field Programmable Gate Array (FPGA) IC 179 276480 6272 256-LBGA
The EP4CE6F17C9L is an Intel Cyclone IV E field programmable gate array (FPGA) offered in a 256‑ball BGA package. It provides a compact, commercially graded programmable logic solution characterized by a defined logic capacity, embedded memory, and a high I/O count for mid-range embedded designs.
Key device attributes include 6,272 logic elements, approximately 0.276 Mbits of on‑chip RAM, 179 I/O pins, a 256‑LBGA package, and a core supply voltage range of 0.970 V to 1.03 V. The device is rated for commercial operation from 0 °C to 85 °C and is RoHS compliant.
Key Features
- Core Architecture Cyclone IV E FPGA architecture in the EP4CE6F17C9L device, providing a programmable fabric for custom logic implementation.
- Logic Capacity 6,272 logic elements available for combinational and sequential logic integration.
- Embedded Memory Approximately 0.276 Mbits of total on‑chip RAM to support data buffering, state storage, and small memories.
- I/O Resources 179 user I/O pins to interface with peripherals, sensors, and external devices in dense board designs.
- Power and Voltage Core supply specified at 0.970 V to 1.03 V, enabling predictable power-domain planning for system design.
- Package and Mounting 256‑LBGA package (supplier lists 256‑FBGA, 17 × 17 mm) with surface‑mount mounting type for compact PCB layouts.
- Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C suitable for standard commercial environments.
- Compliance RoHS compliant, supporting regulatory requirements for lead‑free assembly.
- Documentation Supported by Intel/Altera Cyclone IV device handbook and datasheet material for design, electrical, and timing information.
Unique Advantages
- Right‑sized logic and memory balance: The combination of 6,272 logic elements and approximately 0.276 Mbits of embedded RAM supports mid‑range programmable tasks without excessive board real estate.
- High I/O density: 179 I/O pins allow flexible interfacing options for mixed peripheral and sensor connectivity.
- Compact BGA footprint: 256‑ball BGA packaging enables dense PCB placement while maintaining a high pin count.
- Predictable power domain: Defined core supply range (0.970 V–1.03 V) simplifies power‑supply design and margin planning.
- Commercial temperature grading: Specified 0 °C to 85 °C operating range aligns with standard commercial application environments.
- Standards‑level documentation: Device handbook and datasheet content provide detailed operating conditions, characteristics, and design guidelines.
Why Choose EP4CE6F17C9L?
The EP4CE6F17C9L Cyclone IV E FPGA is positioned for designers seeking a commercially graded, mid‑range programmable logic device that combines a defined logic element count, embedded RAM, and a substantial I/O complement in a compact BGA package. Its documented operating conditions, power requirements, and RoHS compliance support predictable integration into commercial embedded systems.
This part is appropriate for teams that need a documented, vendor‑supported FPGA offering clear electrical and thermal limits, compact packaging, and a balanced resource set for control, interfacing, and custom logic implementations.
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