EP4CE6F17I7N

The EP4CE6F17I7N is an Intel Cyclone® IV field programmable gate array (FPGA) supplied in a 256-LBGA package. It provides 6,272 logic elements with approximately 0.28 Mbits of on-chip RAM and up to 179 I/Os for flexible system integration.

Designed for industrial-grade operation, the device supports a core supply range of 1.15 V–1.25 V and an operating temperature range of −40 °C to 100 °C, making it suitable for temperature-sensitive embedded designs that require reconfigurable logic and a moderate I/O count.

Key Features

• Core Logic — 6,272 logic elements and 392 configurable logic blocks (CLBs) provide the programmable fabric for custom digital functions.
• Embedded Memory — Approximately 0.28 Mbits of total on-chip RAM for data buffering, small FIFOs, and state storage.
• I/O Capacity — Up to 179 I/O pins to interface with sensors, peripherals, and external devices.
• Power — Core voltage supply specified at 1.15 V to 1.25 V to match system power rails and support predictable power budgeting.
• Package and Mounting — 256-LBGA package; supplier device package listed as 256-FBGA (17×17), surface-mount mounting for standard PCB assembly.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Standards Compliance — RoHS compliant.

Unique Advantages

• Balanced Logic and Memory: The combination of 6,272 logic elements with ~0.28 Mbits of RAM supports a wide range of mid-density programmable designs without over-provisioning.
• High I/O Count: 179 available I/Os enable direct interfacing to a variety of external devices and mezzanine connections, reducing the need for additional interface chips.
• Industrial Reliability: Operation across −40 °C to 100 °C provides headroom for industrial applications requiring extended temperature performance.
• Compact BGA Packaging: 256-ball LBGA/FBGA packaging provides a small PCB footprint while preserving routing density for complex board layouts.
• Predictable Power Envelope: A clearly defined core supply range (1.15 V–1.25 V) helps with power-supply design and system-level power planning.
• Manufacturing Compatibility: Surface-mount package type aligns with standard PCB assembly and reflow processes for volume production.

Why Choose EP4CE6F17I7N?

The EP4CE6F17I7N positions itself as a mid-density Cyclone IV FPGA option that pairs a practical logic element count with on-chip RAM and a substantial I/O complement, all in an industrial-grade package. Its defined core-voltage range and broad operating temperature make it a fit for embedded and industrial systems where temperature tolerance and predictable power requirements are important.

This device suits engineers and teams seeking a reprogrammable logic solution with a compact BGA footprint, clear electrical requirements, and the I/O capacity needed to consolidate interfaces and reduce external components. Its combination of features supports scalable designs and straightforward integration into existing manufacturing flows.

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