EP4CE75F23C6N

The EP4CE75F23C6N is a Cyclone® IV E Field Programmable Gate Array (FPGA) from Intel supplied in a 484-BGA package. It delivers a mid-range programmable-logic option with 75,408 logic elements and approximately 2.81 Mbits of embedded memory for designers needing substantial on-chip resources in a compact surface-mount package.

With 292 I/O pins, a low-voltage core supply range of 1.15 V to 1.25 V, and commercial temperature rating, this device targets FPGA-based designs that require balanced logic density, memory, and I/O in a standard commercial operating environment.

Key Features

• Logic Capacity — 75,408 logic elements to implement complex custom digital functions and state machines.
• Embedded Memory — Approximately 2.81 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Resources — 292 user I/O pins to support multiple interfaces and board-level connectivity.
• Power — Core voltage supply range of 1.15 V to 1.25 V for the FPGA core.
• Package & Mounting — 484-ball BGA (484-FBGA, 23×23) in a surface-mount form factor for compact PCB integration.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Custom digital logic and prototyping — Implement and iterate complex logic functions and control systems using the device's sizable logic and memory resources.
• Interface bridging and I/O aggregation — Consolidate multiple signal paths and protocol interfaces using the 292 available I/Os.
• Embedded processing accelerators — Offload specialized processing tasks to FPGA logic and local RAM to optimize system-level performance.

Unique Advantages

• Substantial on-chip resources: 75,408 logic elements and ~2.81 Mbits of embedded memory reduce dependency on external components for many designs.
• High I/O count: 292 I/Os enable flexible board-level interfacing and multi-protocol support within a single FPGA device.
• Compact BGA package: 484-FBGA (23×23) balances board density and thermal/power distribution for surface-mount designs.
• Low-voltage core: 1.15 V–1.25 V supply range supports efficient core operation in power-sensitive applications.
• Commercial temperature grading: Rated for 0 °C to 85 °C operation, suitable for a wide range of standard electronics applications.
• Regulatory compliance: RoHS compliant to meet common environmental and manufacturing requirements.

Why Choose EP4CE75F23C6N?

The EP4CE75F23C6N provides a balanced mix of logic density, embedded memory, and I/O capability in a surface-mount 484-BGA package, making it well suited for designers who need significant on-chip resources without moving to higher-end FPGA families. Its commercial temperature rating and RoHS compliance make it appropriate for mainstream electronic products and prototype-to-production flows.

Ideal for teams building mid-range FPGA-based systems that require integration of multiple interfaces and local memory, this Intel-supplied Cyclone IV E device supports scalable design approaches while keeping board-level BOM and external memory requirements down.

Request a quote or submit an inquiry for pricing and availability of the EP4CE75F23C6N to move your design forward.