EP4CE75F23C8L

The EP4CE75F23C8L is a Cyclone® IV E field programmable gate array (FPGA) IC from Intel, housed in a 484-FBGA (23×23) surface-mount package. It provides a substantial configurable-logic resource set combined with embedded on‑chip RAM and a high I/O count suitable for commercial embedded designs.

Key on-chip characteristics include 75,408 logic elements, approximately 2.81 Mbits of embedded memory (2,810,880 bits), 292 general-purpose I/O pins, and a core supply range of 0.97 V to 1.03 V. The device is RoHS compliant and specified for commercial operating temperatures (0 °C to 85 °C).

Key Features

• Core Architecture — Cyclone IV E Configurable FPGA fabric from the Cyclone IV E family, documented in the Cyclone IV Device Handbook for device- and system-level guidance.
• Logic Capacity 75,408 logic elements to implement mid-to-high density custom logic and control functions on-chip.
• Embedded Memory Approximately 2.81 Mbits of on-chip RAM (2,810,880 bits) for data buffering, FIFOs, and state storage without external memory.
• I/O Resources 292 I/O pins to support extensive peripheral and interface connectivity directly at the FPGA.
• Package & Mounting 484-FBGA (23×23) package, 484-BGA case, designed for surface-mount assembly to support compact board layouts.
• Power Core supply voltage specified from 0.97 V to 1.03 V to match system power-rail design and distribution requirements.
• Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental compatibility.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic, protocol handling, and application-specific processing in space-constrained commercial devices.
• High-Density I/O Interfaces — Aggregate and translate multiple peripheral interfaces using the device’s 292 I/O pins to streamline board-level design.
• On-Chip Memory-Dependent Functions — Use the approximately 2.81 Mbits of embedded RAM for buffering, small data stores, and intermediate processing without external memory.
• Prototyping and Development — Leverage the Cyclone IV E architecture to prototype and validate custom logic and system-level functions before production deployment.

Unique Advantages

• High configurable logic capacity: 75,408 logic elements enable complex logic implementation while reducing the need for external ASICs or multiple discrete devices.
• Significant on-chip RAM: Approximately 2.81 Mbits of embedded memory supports data buffering and state storage, simplifying memory hierarchy and board routing.
• Extensive I/O availability: 292 I/O pins provide flexibility to connect sensors, peripherals, and external interfaces directly to the FPGA fabric.
• Compact, surface-mount package: 484-FBGA (23×23) package balances high pin count with a compact footprint for dense PCB designs.
• Commercial temperature rating: Specified 0 °C to 85 °C operating range for reliable performance in commercial environments.
• Manufacturer documentation: Supported by the Cyclone IV Device Handbook and datasheet-level specifications for detailed design and integration guidance.

Why Choose EP4CE75F23C8L?

The EP4CE75F23C8L positions itself as a capable, commercial-grade Cyclone IV E FPGA for designers who need substantial on-chip logic, embedded memory, and broad I/O in a compact BGA package. Its combination of 75,408 logic elements, roughly 2.81 Mbits of RAM, and 292 I/O pins makes it well suited for mid-to-high complexity embedded applications where integration and board-area efficiency matter.

Backed by manufacturer datasheet and device handbook documentation, this part supports informed design decisions and system integration for commercial applications requiring configurable logic and on‑chip memory resources.

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