EP4CE75F23C8LN

The EP4CE75F23C8LN is a Cyclone® IV E field-programmable gate array (FPGA) from Intel. It delivers programmable logic capacity and embedded memory in a surface-mount 484‑FBGA (23×23) package, designed for commercial-grade electronic designs.

With 75,408 logic elements, approximately 2.8 Mbits of on-chip RAM, and up to 292 I/O pins, this device targets commercial embedded systems and digital designs that require moderate logic density, substantial embedded memory, and a compact BGA footprint.

Key Features

• Logic Capacity — 75,408 logic elements provide the programmable fabric to implement complex digital functions and custom logic.
• Embedded Memory — Approximately 2.8 Mbits of on-chip RAM for data buffering, FIFOs, and intermediate storage within FPGA designs.
• I/O Resources — Up to 292 general-purpose I/O pins to interface with external peripherals, sensors, and high-pin-count subsystems.
• Package and Mounting — 484‑FBGA (23×23) package, surface-mount mounting type, enabling high-density board integration in a compact footprint.
• Power and Core Voltage — Core supply voltage range specified at 0.970 V to 1.03 V to match system power architectures that support low-voltage FPGA cores.
• Operating Range — Commercial-grade operating temperature range from 0 °C to 85 °C for typical commercial-environment deployments.
• Standards and Compliance — RoHS compliant, meeting common environmental requirements for lead-free assembly.

Typical Applications

• Commercial Embedded Systems — Use where programmable logic, substantial embedded RAM, and multiple I/O are required in a compact BGA package.
• High‑Density I/O Bridging — Suitable for designs that need up to 292 I/O signals for bus interfacing, protocol translation, or general-purpose signal aggregation.
• On‑board Processing and Buffering — Embedded memory and logic capacity support local data processing, buffering, and custom control functions within system boards.

Unique Advantages

• High Logic Density: 75,408 logic elements enable implementation of sizeable custom logic functions without external ASICs.
• Substantial On‑Chip Memory: Approximately 2.8 Mbits of embedded RAM reduce the need for external memory in many buffering and FIFO use cases.
• Wide I/O Count: 292 I/O pins support complex interfacing and multiple peripheral connections from a single device.
• Compact BGA Package: 484‑FBGA (23×23) enables space-efficient PCB layouts while providing high pin density for routing flexibility.
• Low‑Voltage Core: Specified core voltage range of 0.970–1.03 V supports modern low-voltage power domains.
• Commercial‑Grade Suitability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product deployments.

Why Choose EP4CE75F23C8LN?

The EP4CE75F23C8LN Cyclone IV E FPGA balances significant programmable logic capacity and embedded memory with a high I/O count in a compact 484‑FBGA package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of commercial electronic products where board space, I/O flexibility, and on-chip memory are priorities.

This device is well suited to teams designing mid- to high-complexity programmable logic solutions that value integration and density. Backed by Intel's Cyclone IV device family documentation and product support resources, the EP4CE75F23C8LN provides a scalable option for commercial embedded designs.

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