EP4CE75F23C9L

The EP4CE75F23C9L is an Intel Cyclone® IV E field-programmable gate array (FPGA) supplied in a 484-ball BGA package. It delivers a balanced combination of programmable logic capacity, embedded memory, and I/O resources for commercial-grade digital designs.

Key on-chip resources include 75,408 logic elements, approximately 2.81 Mbits of embedded memory, and 292 I/O pins. The device operates with a core supply range of 0.97–1.03 V, is rated for commercial temperature operation (0 °C to 85 °C), and is RoHS compliant.

Key Features

• Core Logic — 75,408 logic elements for implementing complex programmable logic and state machines.
• Embedded Memory — Approximately 2.81 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage.
• I/O Resources — 292 user I/Os to accommodate high-density interfacing and signal routing.
• Package & Mounting — 484-FBGA (23 × 23) package, surface-mount assembly in a 484-ball BGA footprint for compact board integration.
• Power Supply — Core voltage supply specified at 0.97–1.03 V for predictable power and timing behavior.
• Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance — RoHS compliant.
• Reference Documentation — Supported by the Cyclone IV Device Handbook and device datasheet covering operating conditions, DC characteristics, power consumption, switching characteristics, and transceiver performance.

Typical Applications

• Custom digital logic and prototyping — Implement glue logic, protocol converters, and custom finite-state machines using the available logic elements and embedded RAM.
• High-density I/O interfacing — Use the 292 I/Os for board-level signal aggregation, peripheral interfaces, and multi-channel data routing.
• Embedded system acceleration — Offload deterministic, parallel tasks to programmable fabric while leveraging on-chip memory for local buffers.

Unique Advantages

• Substantial programmable capacity: 75,408 logic elements enable implementation of sizable custom logic without immediate migration to larger families.
• On-chip memory for local data handling: Approximately 2.81 Mbits of embedded RAM reduce dependence on external memory for buffering and temporary storage.
• Broad I/O capability: 292 I/Os provide flexibility for interfacing multiple peripherals, buses, or I/O standards at the board level.
• Compact BGA footprint: 484-FBGA (23×23) package supports high-density PCB designs while maintaining surface-mount assembly compatibility.
• Commercial temperature rating: 0 °C to 85 °C operation suits a wide range of general-purpose electronic products.
• Standards-conscious supply: RoHS compliance supports regulatory and sustainability requirements.

Why Choose EP4CE75F23C9L?

The EP4CE75F23C9L positions itself as a versatile, commercially graded Cyclone IV E FPGA that balances programmable logic density, embedded memory, and extensive I/O in a compact BGA package. Its defined core voltage range and documented device handbook details support predictable integration into commercial electronic designs.

This device is well suited for development teams and product designers who need flexible programmable logic with substantial on-chip resources for prototyping, I/O-heavy applications, and embedded acceleration while leveraging Intel’s Cyclone IV documentation and design guidance.

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