EP4CE75F23I8L

The EP4CE75F23I8L is a Cyclone® IV E field-programmable gate array (FPGA) IC from Intel (Altera) provided in a 484-FBGA (23 × 23) package. It delivers a balance of programmable logic, embedded memory, and I/O capacity for system-level integration in industrial applications.

With 75,408 logic elements, approximately 2.81 Mbits of on-chip RAM, and 292 user I/O pins, this device is documented in the Cyclone IV Device Handbook (Volume 3) and is specified for surface-mount assembly, a defined core supply range, and industrial operating temperatures.

Key Features

• FPGA Core  Cyclone IV E architecture provided as a field-programmable gate array IC with 75,408 logic elements suitable for complex logic integration.
• Embedded Memory  Approximately 2.81 Mbits of on-chip RAM for buffering, state storage, and embedded data structures.
• I/O Capacity  292 user I/O pins to support a wide variety of external interfaces and peripherals.
• Package and Mounting  484-FBGA (23 × 23) package case, designed for surface-mount assembly in compact board layouts.
• Power Range  Core voltage supply specified from 970 mV to 1.03 V to match regulated FPGA core domains.
• Industrial Temperature Rating  Rated for operation from −40 °C to 100 °C, addressing industrial ambient conditions.
• Standards Compliance  RoHS compliant as specified in the product data.
• Manufacturer Documentation  Device details and operating conditions are documented in the Cyclone IV Device Handbook, Volume 3.

Unique Advantages

• High logic density: 75,408 logic elements provide substantial programmable resources for integration of complex functions on a single device.
• Significant embedded memory: Approximately 2.81 Mbits of on-chip RAM reduces external memory requirements for many designs.
• Generous I/O count: 292 I/Os enable connectivity to multiple peripherals and external interfaces without extensive board-level multiplexing.
• Industrial temperature range: Specified operation from −40 °C to 100 °C supports deployment in demanding environmental conditions.
• Compact BGA package: 484-FBGA (23 × 23) enables a smaller PCB footprint while providing high pin count for system integration.
• Documented platform: Supported by the Cyclone IV Device Handbook (Volume 3) for detailed electrical, timing, and operating guidance.

Why Choose EP4CE75F23I8L?

The EP4CE75F23I8L positions itself as a versatile Cyclone IV E FPGA option for designers seeking a combination of substantial logic capacity, embedded RAM, and a high I/O count in a compact, surface-mount BGA package. Its core supply window and industrial temperature rating make it suitable for systems that require defined operating conditions and environmental robustness.

This device is appropriate for engineering teams that need predictable device documentation and a well-characterized FPGA platform from Intel (Altera), with on-chip resources that can reduce system BOM and simplify board-level design choices.

Request a quote or submit a pricing inquiry today to evaluate EP4CE75F23I8L for your next FPGA-based design.