EP4CE75F23I8LN

The EP4CE75F23I8LN is a Cyclone® IV E field-programmable gate array (FPGA) offered in a 484-ball BGA package. It combines a high count of configurable logic with substantial on-chip memory and a large I/O complement to support complex digital designs.

Targeted for industrial-grade deployments, this device delivers flexible integration for embedded control, interface consolidation, and configurable logic tasks where a wide operating temperature range and robust packaging are required.

Key Features

• Logic Capacity — 75,408 logic elements to implement complex state machines, datapaths, and custom digital functions.
• Embedded Memory — Approximately 2.81 Mbits of on-chip RAM for buffering, FIFOs, and embedded data storage.
• I/O Density — 292 user I/Os to support multiple parallel interfaces, peripheral connectivity, and high-pin-count designs.
• Supply and Power — Core supply range of 970 mV to 1.03 V to match system power rails and enable predictable core operation.
• Package — 484-BGA (supplier package: 484-FBGA, 23×23) in a surface-mount format for compact board-level integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to support demanding environmental conditions.
• Compliance — RoHS-compliant device suitable for applications requiring lead-free assembly and materials compliance.
• Documentation Coverage — Device handbook and datasheet coverage includes operating conditions, DC characteristics, power consumption, and switching characteristics to support detailed design and validation.

Typical Applications

• Industrial control and automation — Industrial-grade temperature rating and abundant I/O make the device well suited for configurable control logic and interface tasks in factory and process environments.
• Embedded system integration — Large logic capacity and embedded RAM enable consolidation of custom glue logic, protocol translation, and data buffering within a single FPGA.
• High-density I/O designs — With 292 I/Os, the device supports boards that require many parallel interfaces or multiple peripheral connections.

Unique Advantages

• Substantial programmable logic: 75,408 logic elements provide headroom for complex IP blocks, state machines, and custom accelerators without external glue logic.
• Embedded memory for on-chip buffering: Approximately 2.81 Mbits of RAM reduces dependency on external memory for many control, buffering, and streaming tasks.
• High I/O count: 292 I/Os allow designers to consolidate multiple interfaces and peripherals directly onto the FPGA, simplifying board-level routing and BOM.
• Industrial-ready thermal performance: −40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
• Compact BGA packaging: 484-BGA (484-FBGA, 23×23) surface-mount package offers high density in a board-area-efficient footprint.
• Standards-conscious supply: RoHS compliance facilitates lead-free assembly and regulatory alignment for many production environments.

Why Choose EP4CE75F23I8LN?

The EP4CE75F23I8LN positions itself as a configurable, industrial-grade FPGA that balances significant logic density, on-chip memory, and a high I/O count in a compact BGA package. Its documented operating and electrical characteristics support engineering evaluation and system integration for industrial and embedded applications.

This device is appropriate for design teams needing a reliable, field-programmable fabric to consolidate interfaces, implement custom logic, and handle mid-sized embedded memory requirements while maintaining operation across a wide temperature range.

If you would like pricing, availability, or to request a formal quote for the EP4CE75F23I8LN, please submit a request or inquiry and our team will respond with the next steps.