EP4CE75F29C6N

The EP4CE75F29C6N is a Cyclone® IV family Field Programmable Gate Array (FPGA) from Intel, provided in a 780-ball BGA package. It delivers a balance of logic capacity, embedded memory, and I/O density suitable for commercial-grade programmable-logic applications.

With 75,408 logic elements, approximately 2.81 Mbits of on-chip RAM, and 426 user I/O pins, this device targets designs that require mid-range integration of logic, memory, and peripheral interfacing while operating within standard commercial temperature and power envelopes.

Key Features

• Core Architecture Cyclone® IV FPGA family device from Intel providing programmable logic resources for custom digital implementations.
• Logic Capacity 75,408 logic elements to implement complex combinational and sequential logic functions.
• Embedded Memory Approximately 2.81 Mbits of on-chip RAM for buffering, lookup tables, and small data storage needs.
• High I/O Count 426 user I/O pins to support extensive peripheral and interface connectivity.
• Power Core supply voltage range of 1.15 V to 1.25 V to match system power domains.
• Package & Mounting 780-ball fine-pitch BGA package (780-FBGA, 29×29) designed for surface-mount assembly.
• Operating Range & Compliance Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• Custom digital logic and prototyping — Implement and iterate bespoke digital functions using the device's substantial logic element count.
• High-density I/O systems — Support complex peripheral and interface requirements with 426 user I/O pins.
• Memory-assisted datapath functions — Use the approximately 2.81 Mbits of on-chip RAM for buffering, FIFOs, and small lookup tables within signal-processing or control flows.

Unique Advantages

• High logic density: 75,408 logic elements enable significant on-chip implementation of custom hardware logic without immediate reliance on external ASICs or CPLDs.
• Substantial embedded memory: Approximately 2.81 Mbits of RAM supports local data storage for packet buffering, temporary storage, or algorithmic needs.
• Extensive connectivity: 426 user I/O pins provide flexibility for interfacing with sensors, peripherals, and external devices.
• Compact BGA packaging: 780-FBGA (29×29) offers a high-pin-count, space-efficient form factor for surface-mount assembly.
• Commercial-grade suitability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial product designs.
• Vendor family support: Part of Intel's Cyclone® IV FPGA family, facilitating access to family-level documentation and resources.

Why Choose EP4CE75F29C6N?

The EP4CE75F29C6N delivers a balanced mix of logic capacity, embedded memory, and high I/O count in a compact 780-ball BGA package, making it well suited for commercial designs that require significant on-chip logic and interfacing without exceeding commercial temperature or power constraints. As a Cyclone® IV family device from Intel, it fits applications that need scalable programmable logic with documented hardware characteristics.

Choose this device for projects where mid-range integration, predictable supply voltage (1.15 V–1.25 V), and a large number of user I/Os are key design drivers, and where commercial-grade operation and RoHS compliance are required.

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