EP4CE75F29C8

The EP4CE75F29C8 is a Cyclone® IV E family Field Programmable Gate Array (FPGA) offered in a 780-ball BGA package. It provides a high I/O count and substantial on-chip memory, making it suitable for designs that require flexible logic, dense interfacing, and configurable memory resources.

Designed for commercial-grade applications, this FPGA combines 75,408 logic elements with approximately 2.81 Mbits of embedded memory and 426 I/O pins, delivering programmable system integration in a surface-mount 780-FBGA (29×29) package. It operates from a 1.15 V to 1.25 V core supply and supports an ambient operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — 75,408 logic elements provide substantial programmable logic resources for implementing custom digital functions and control logic.
• Embedded Memory — Approximately 2.81 Mbits of on-chip RAM to support buffers, FIFOs, state machines, and other memory-intensive logic without external RAM.
• High I/O Count — 426 I/O pins enable broad connectivity for multi-channel interfaces, sensors, and peripheral devices.
• Package and Mounting — Surface-mount 780-BGA package (supplier device package: 780-FBGA, 29×29) suitable for compact board layouts requiring high pin density.
• Power Supply — Core voltage range of 1.15 V to 1.25 V aligns with standard low-voltage FPGA core supplies for system-level power planning.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for typical commercial-environment deployments.
• RoHS Compliant — Conforms to RoHS requirements for lead-free assembly and regulatory needs.

Typical Applications

• Communications & Networking — High I/O count and large logic capacity enable implementation of protocol bridging, packet processing, and interface aggregation functions.
• Embedded Control — On-chip memory and abundant logic elements support deterministic control, motor drives, and custom state machines for embedded systems.
• Signal Processing & Data Acquisition — The combination of logic resources and embedded RAM suits pre-processing, buffering, and real-time data handling in measurement equipment and sensor hubs.
• Consumer & Multimedia Devices — Flexible I/O and programmable logic allow custom interfaces, audio/video preprocessing, and peripheral management in consumer electronics.

Unique Advantages

• Substantial Logic Resource: 75,408 logic elements enable complex custom digital designs without immediate need for larger devices.
• On-Chip Memory: Approximately 2.81 Mbits of embedded RAM reduces dependence on external memory for many buffering and FIFO needs, simplifying BOM and board routing.
• High Connectivity: 426 I/O pins provide the flexibility to support multiple interfaces and parallel peripherals from a single FPGA package.
• Compact High-Density Package: The 780-FBGA (29×29) package delivers high pin count in a compact footprint for space-constrained PCBs.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to match typical commercial product environments and deployment scenarios.
• Regulatory Compatibility: RoHS compliance supports lead-free assembly and aligns with common regulatory requirements for electronic products.

Why Choose EP4CE75F29C8?

The EP4CE75F29C8 positions itself as a flexible, commercially graded FPGA option for designs that require a balance of logic density, on-chip memory, and high I/O in a single package. Its combination of 75,408 logic elements, approximately 2.81 Mbits of embedded RAM, and 426 I/O pins makes it well suited to engineers building complex digital subsystems, multi-interface controllers, and data-path processing blocks.

With a surface-mount 780-FBGA (29×29) package, a standard low-voltage core supply range (1.15 V to 1.25 V), and RoHS compliance, this device integrates into modern PCB manufacturing flows while providing the programmable resources needed for scalable design iterations and long-term product support.

Request a quote or submit an inquiry to receive pricing and availability information for EP4CE75F29C8 and to discuss how it fits your next FPGA-based design.