EP4CE75F29C8N

IC FPGA 426 I/O 780FBGA
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 426 2810880 75408 780-BGA

Quantity 1,091 Available (as of May 4, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BGANumber of I/O426Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4713Number of Logic Elements/Cells75408
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2810880

Overview of EP4CE75F29C8N – Cyclone® IV E FPGA, 75,408 logic elements, ~2.81 Mbits RAM, 426 I/Os, 780‑BGA

The EP4CE75F29C8N is a Cyclone® IV E field programmable gate array (FPGA) from Intel (Altera) that combines a mid-range logic fabric with on-chip embedded memory and a large I/O count in a compact BGA package. Designed for applications that require significant programmable logic capacity alongside substantial memory and I/O resources, the device targets commercial-temperature designs.

The device is supplied in a 780‑FBGA (29×29) surface-mount package and is specified for operation from 0 °C to 85 °C with a core supply range of 1.15 V to 1.25 V. The Cyclone IV device handbook provides detailed electrical, switching and packaging specifications.

Key Features

  • Logic Capacity — 75,408 logic elements provide extensive programmable logic resources for complex digital designs.
  • Embedded Memory — Approximately 2.81 Mbits of on-chip RAM for buffer, FIFO and state-storage needs.
  • I/O Count — 426 user I/Os to support wide parallel interfaces and multiple peripheral connections.
  • Package & Mounting — 780‑FBGA (29×29) package, surface-mount mounting type suitable for dense board-level integration.
  • Supply Voltage — Core voltage range: 1.15 V to 1.25 V, enabling standard Cyclone IV power architectures.
  • Operating Temperature — Commercial grade operation from 0 °C to 85 °C.
  • Standards & Compliance — RoHS compliant.
  • Documentation — Supported by the Cyclone IV device handbook covering operating conditions, DC characteristics, switching specifications, ESD performance and other electrical details.

Unique Advantages

  • High logic density: With 75,408 logic elements, the EP4CE75F29C8N enables implementation of complex state machines, data paths and custom accelerators on a single device.
  • Substantial on-chip memory: Approximately 2.81 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
  • Extensive I/O integration: 426 I/Os allow broad connectivity options for parallel interfaces, sensor arrays or multi-channel peripherals.
  • Compact BGA package: The 780‑FBGA (29×29) enables high-density board designs while keeping the device surface-mount compatible for modern assembly flows.
  • Commercial temperature rating: Specified 0 °C to 85 °C operation for deployments in standard commercial environments.
  • Compliance-ready: RoHS compliance supports environmentally conscious product designs and regulatory requirements.

Why Choose EP4CE75F29C8N?

The EP4CE75F29C8N positions itself as a mid-range Cyclone IV E FPGA offering a balance of logic capacity, embedded memory and high I/O density in a compact 780‑FBGA package. It is suited to designs that require substantial on-chip resources while staying within commercial thermal limits and a standard core voltage envelope.

Backed by the Cyclone IV device handbook for detailed electrical and switching characteristics, the device is appropriate for teams seeking a programmable, RoHS-compliant FPGA solution with significant on-chip memory and I/O for integration and consolidation of system functions.

Request a quote or submit an inquiry for pricing and availability for EP4CE75F29C8N today.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up